Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154890 | Multi-tier IC package including processor and high bandwidth memory | Shiqun Gu, Tianqiang Huang | 2024-11-26 |
| 10212818 | Methods and apparatus for a substrate core layer | Fei Yu, Anwar Mohammed | 2019-02-19 |
| 8952533 | Devices and methods for 2.5D interposers | Anwar Mohammed, Weifeng Liu | 2015-02-10 |
| 8519543 | Large sized silicon interposers overcoming the reticle area limitations | Haoyu Song, Cao Wei, Anwar Mohammed | 2013-08-27 |