Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10714528 | Chip package and manufacturing method thereof | Hsin Kuan, Chin-Ching Huang, Chia-Ming Cheng | 2020-07-14 |
| 9449897 | Chip package and method for forming the same | Bai-Yao Lou, Sheng-Yuan Lee | 2016-09-20 |
| 9023676 | Wafer packaging method | Chih-Hao Chen, Bai-Yao Lou | 2015-05-05 |
| 8035213 | Chip package structure and method of manufacturing the same | Chang-Chi Lee, Yuan-Ting Chang | 2011-10-11 |
| 7651937 | Bumping process and structure thereof | Chueh-An Hsieh, Li-Cheng Tai, Shyh-Ing Wu | 2010-01-26 |
| 7518241 | Wafer structure with a multi-layer barrier in an UBM layer network device with power supply | Li-Cheng Tai, Jui-I Yu, Jiunn Chen, Chueh-An Hsieh, Shyh-Ing Wu +2 more | 2009-04-14 |
| 6737353 | Semiconductor device having bump electrodes | Jen-Kuang Fang, Ching-Hua Chiang, Chau Fu Weng | 2004-05-18 |
| 6716736 | Method for manufacturing an under-bump metallurgy layer | Chih-Hsiang Hsu | 2004-04-06 |
| 6692581 | Solder paste for fabricating bump | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Ching-Fu Horng, Shyh-Ing Wu +5 more | 2004-02-17 |
| 6229702 | Ball grid array semiconductor package having improved heat dissipation efficiency, overall electrical performance and enhanced bonding capability | Su Tao, Chin-Long Wu, Tai-Chun Huang, Han-Hsiang Huang, Shin-Hua Chao | 2001-05-08 |