Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11031273 | Physical vapor deposition (PVD) electrostatic chuck with improved thermal coupling for temperature sensitive processes | Bonnie T. Chia, Tomoharu Matsushita, Cheng-Hsiung Tsai | 2021-06-08 |
| 10388532 | Methods and devices using PVD ruthenium | Jothilingam Ramalingam, Jianxin Lei, Xianmin Tang | 2019-08-20 |
| 9613846 | Pad design for electrostatic chuck surface | Govinda Raj, Cheng-Hsiung Tsai, Robert T. Hirahara, Kadthala Ramaya Narendrnath, Manjunatha Koppa | 2017-04-04 |
| 7732327 | Vapor deposition of tungsten materials | Sang-Hyeob Lee, Avgerinos V. Gelatos, Kai Wu, Amit Khandelwal, Emily Renuart +2 more | 2010-06-08 |