RL

Richard J. Lebel

IBM: 13 patents #8,581 of 70,183Top 15%
Overall (All Time): #388,499 of 4,157,543Top 10%
13
Patents All Time

Issued Patents All Time

Showing 1–13 of 13 patents

Patent #TitleCo-InventorsDate
7130038 Method and apparatus for optical film measurements in a controlled environment Fredrik Maurer, Paul Smith, Theodore G. van Kessel, Hematha K. Wickramasinghe 2006-10-31
6967715 Method and apparatus for optical film measurements in a controlled environment Fredrik Maurer, Paul Smith, Theodore G. van Kessel, Hematha K. Wickramasinghe 2005-11-22
6738142 Integrated wafer cassette metrology assembly Theodore G. van Kessel, Hematha K. Wickramasinghe 2004-05-18
6579149 Support and alignment device for enabling chemical mechanical polishing rinse and film measurements Frederic Maurer, Rock Nadeau, Paul Smith, Hemantha K. Wickramasinghe, Theodore G. van Kessel 2003-06-17
6567172 System and multipass probe for optical interference measurements Philip Charles Danby Hobbs, Martin P. O'Boyle, Theodore G. van Kessel, Hemantha K. Wickramasinghe 2003-05-20
6334807 Chemical mechanical polishing in-situ end point system Rock Nadeau, Martin P. O'Boyle, Paul Smith, Theodore G. van Kessel, Hemantha K. Wickramasinghe 2002-01-01
6319093 Chemical-mechanical polishing system and method for integrated spin dry-film thickness measurement Frederic Maurer, Rock Nadeau, Paul Smith, Hemantha K. Wickramasinghe, Theodore G. van Kessel 2001-11-20
6247368 CMP wet application wafer sensor Scott R. Cline, Willi O. Kalvaitis, Charles A. McKinney, Douglas P. Nadeau, Theodore G. van Kessel 2001-06-19
6022266 In-situ pad conditioning process for CMP Timothy Scott Bullard, Rock Nadeau, Paul Smith 2000-02-08
5885135 CMP wafer carrier for preferential polishing of a wafer Daniel D. Desorcie, Charles A. McKinney, Rock Nadeau, Timothy J. Rickard, Jr., Paul Smith +2 more 1999-03-23
5849629 Method of forming a low stress polycide conductors on a semiconductor chip Anthony K. Stamper, Gary L. Langdeau 1998-12-15
5738568 Flexible tilted wafer carrier Robert A. Jurjevic, Matthew Miller 1998-04-14
5381234 Method and apparatus for real-time film surface detection for large area wafers Steven G. Barbee, Tony F. Heinz, Leping Li, Victor J. Silvestri 1995-01-10