Issued Patents All Time
Showing 1–25 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12211821 | Package-on-package assembly with wire bond vias | Ellis Chau, Reynaldo Co, Roseann Alatorre, Wei-Shun Wang, Se Young Yang | 2025-01-28 |
| 11735563 | Package-on-package assembly with wire bond vias | Ellis Chau, Reynaldo Co, Roseann Alatorre, Wei-Shun Wang, Se Young Yang | 2023-08-22 |
| 11189595 | Package-on-package assembly with wire bond vias | Ellis Chau, Reynaldo Co, Roseann Alatorre, Wei-Shun Wang, Se Young Yang | 2021-11-30 |
| 10756049 | Package-on-package assembly with wire bond vias | Ellis Chau, Reynaldo Co, Roseann Alatorre, Wei-Shun Wang, Se Young Yang | 2020-08-25 |
| 9761558 | Package-on-package assembly with wire bond vias | Ellis Chau, Reynaldo Co, Roseann Alatorre, Wei-Shun Wang, Se Young Yang | 2017-09-12 |
| 9716075 | Semiconductor chip assembly and method for making same | Teck-Gyu Kang, Wei-Shun Wang, Hiroaki Sato, Kiyoaki Hashimoto, Yoshikuni Nakadaira +3 more | 2017-07-25 |
| 9666450 | Substrate and assembly thereof with dielectric removal for increased post height | Kazuo Sakuma, Belgacem Haba | 2017-05-30 |
| 9337165 | Method for manufacturing a fan-out WLP with package | Hiroaki Sato, Kiyoaki Hashimoto, Yoshikuni Nakadaira, Norihito Masuda, Belgacem Haba +1 more | 2016-05-10 |
| 9318460 | Substrate and assembly thereof with dielectric removal for increased post height | Kazuo Sakuma, Belgacem Haba | 2016-04-19 |
| 9252122 | Package-on-package assembly with wire bond vias | Ellis Chau, Reynaldo Co, Roseann Alatorre, Wei-Shun Wang, Se Young Yang | 2016-02-02 |
| 9137903 | Semiconductor chip assembly and method for making same | Teck-Gyu Kang, Wei-Shun Wang, Hiroaki Sato, Kiyoaki Hashimoto, Yoshikuni Nakadaira +3 more | 2015-09-15 |
| 9136197 | Impedence controlled packages with metal sheet or 2-layer RDL | Belgacem Haba, Ellis Chau, Wael Zohni, Richard Dewitt Crisp | 2015-09-15 |
| 9105483 | Package-on-package assembly with wire bond vias | Ellis Chau, Reynaldo Co, Roseann Alatorre, Wei-Shun Wang, Se Young Yang | 2015-08-11 |
| 9041227 | Package-on-package assembly with wire bond vias | Ellis Chau, Reynaldo Co, Roseann Alatorre, Wei-Shun Wang, Se Young Yang | 2015-05-26 |
| 8981579 | Impedance controlled packages with metal sheet or 2-layer rdl | Belgacem Haba, Ellis Chau, Wael Zohni, Richard Dewitt Crisp | 2015-03-17 |
| 8957520 | Microelectronic assembly comprising dielectric structures with different young modulus and having reduced mechanical stresses between the device terminals and external contacts | Hiroaki Sato, Yukio Hashimoto, Yoshikuni Nakadaira, Norihito Masuda, Belgacem Haba +1 more | 2015-02-17 |
| 8951845 | Methods of fabricating a flip chip package for dram with two underfill materials | Kazuo Sakuma, Ilyas Mohammed | 2015-02-10 |
| 8940630 | Method of making wire bond vias and microelectronic package having wire bond vias | Zhijun Zhao, Ellis Chau | 2015-01-27 |
| 8890304 | Fan-out microelectronic unit WLP having interconnects comprising a matrix of a high melting point, a low melting point and a polymer material | Hiroaki Sato, Kiyoaki Hashimoto, Yoshikuni Nakadaira, Norihito Masuda, Belgacem Haba +1 more | 2014-11-18 |
| 8884432 | Substrate and assembly thereof with dielectric removal for increased post height | Kazuo Sakuma, Belgacem Haba | 2014-11-11 |
| 8836136 | Package-on-package assembly with wire bond vias | Ellis Chau, Reynaldo Co, Roseann Alatorre, Wei-Shun Wang, Se Young Yang +1 more | 2014-09-16 |
| 8816514 | Microelectronic assembly with joined bond elements having lowered inductance | Belgacem Haba, Philip R. Osborn | 2014-08-26 |
| 8785790 | High strength through-substrate vias | Cyprian Emeka Uzoh, Charles G. Woychik, Terrence Caskey, Belgacem Haba, Hiroaki Sato | 2014-07-22 |
| 8786083 | Impedance controlled packages with metal sheet or 2-layer RDL | Belgacem Haba, Ellis Chau, Wael Zohni, Richard Dewitt Crisp | 2014-07-22 |
| 8637992 | Flip chip package for DRAM with two underfill materials | Kazuo Sakuma, Ilyas Mohammed | 2014-01-28 |