OH

Oliver Hellmund

Infineon Technologies Ag: 20 patents #386 of 7,486Top 6%
IA Infineon Technologies Austria Ag: 3 patents #336 of 1,126Top 30%
TW Technische Universität Wien: 1 patents #75 of 329Top 25%
📍 Neubiberg, DE: #15 of 238 inventorsTop 7%
Overall (All Time): #178,602 of 4,157,543Top 5%
23
Patents All Time

Issued Patents All Time

Showing 1–23 of 23 patents

Patent #TitleCo-InventorsDate
12300759 Method of manufacturing a hybrid device Frank Singer, Brendan Holland, Matthias Sperl 2025-05-13
12107130 Semiconductor device having semiconductor device elements in a semiconductor layer Ingo Muri, Johannes Baumgartl, Jacob Tillmann Ludwig, Iris Moder, Thomas Neidhart +2 more 2024-10-01
11552048 Semiconductor device including an electrical contact with a metal layer arranged thereon Barbara Eichinger, Thorsten Meyer, Ingo Muri 2023-01-10
11069626 Molding compound and semiconductor package with a molding compound Anton Mauder, Peter Irsigler, Hanno Melzner, Stefan Miethaner, Sebastian Schmidt +1 more 2021-07-20
11038028 Semiconductor device and manufacturing method Ingo Muri, Johannes Baumgartl, Jacob Tillmann Ludwig, Iris Moder, Thomas Neidhart +2 more 2021-06-15
11011409 Devices with backside metal structures and methods of formation thereof Ingo Muri, Johannes Baumgartl, Iris Moder, Thomas Neidhart, Hans-Joachim Schulze 2021-05-18
10707865 Switch device Anton Mauder, Martina Seider-Schmidt, Hans-Joachim Schulze, Sebastian Schmidt, Peter Irsigler 2020-07-07
10566426 Forming silicon oxide layers by radical oxidation and semiconductor device with silicon oxide layer Anton Mauder, Peter Irsigler, Jens Peter Konrath, David Laforet, Maik Langner +5 more 2020-02-18
10553675 Isolation of semiconductor device with buried cavity Sebastian Schmidt, Donald Dibra, Peter Irsigler, Andreas Meiser, Hans-Joachim Schulze +2 more 2020-02-04
10535553 Devices with backside metal structures and methods of formation thereof Ingo Muri, Johannes Baumgartl, Iris Moder, Thomas Neidhart, Hans-Joachim Schulze 2020-01-14
10373868 Method of processing a porous conductive structure in connection to an electronic component on a substrate Martin Mischitz, Markus Heinrici, Michael Roesner, Caterina Travan, Manfred Schneegans +2 more 2019-08-06
10325804 Method of wafer thinning and realizing backside metal structures Johannes Baumgartl, Iris Moder, Ingo Muri, Thomas Neidhart, Hans-Joachim Schulze 2019-06-18
10199332 Method of manufacturing a semiconductor device comprising a support element and semiconductor device comprising a support element Peter Irsigler, Sebastian Schmidt, Hans-Joachim Schulze, Martina Seider-Schmidt 2019-02-05
10199372 Monolithically integrated chip including active electrical components and passive electrical components with chip edge stabilization structures Ingo Muri, Iris Moder, Johannes Baumgartl, Annette Saenger, Barbara Eichinger +2 more 2019-02-05
10177033 Methods for forming a semiconductor device and semiconductor devices Peter Irsigler, Sebastian Schmidt, Hans-Joachim Schulze, Martina Seider-Schmidt 2019-01-08
10158356 Switch device Anton Mauder, Martina Seider-Schmidt, Hans-Joachim Schulze, Sebastian Schmidt, Peter Irsigler 2018-12-18
10121859 Method of manufacturing semiconductor devices with transistor cells and semiconductor device Ravi Keshav Joshi, Johannes Baumgartl, Oliver Blank, Martin Poelzl 2018-11-06
10074566 Semiconductor device and methods for forming a plurality of semiconductor devices Johannes Baumgartl, Manfred Engelhardt, Iris Moder, Ingo Muri 2018-09-11
9960076 Devices with backside metal structures and methods of formation thereof Ingo Muri, Johannes Baumgartl, Iris Moder, Thomas Neidhart, Hans-Joachim Schulze 2018-05-01
9875926 Substrates with buried isolation layers and methods of formation thereof Iris Moder, Ingo Muri, Johannes Baumgartl, Manfred Engelhardt, Hans-Joachim Schulze 2018-01-23
9761548 Bond pad structure Peter Irsigler, Martina Seider-Schmidt, Sebastian Schmidt 2017-09-12
8922016 Method for producing a composite material, associated composite material and associated semiconductor circuit arrangements Daniel Kraft, Friedrich Kroener, Francisco Javier Santos Rodriguez, Carsten von Koblinski 2014-12-30
8025783 Method for producing a composite material, associated composite material and associated semiconductor circuit arrangements Daniel Kraft, Friedrich Kroener, Francisco Javier Santos Rodriguez, Carsten von Koblinski 2011-09-27