| 8297986 |
Integrated circuit socket |
Seah Sun Too, Raj N. Master, Jacquana Diep |
2012-10-30 |
| 8232138 |
Circuit board with notched stiffener frame |
Kevin Lim, Seah Sun Too |
2012-07-31 |
| 7923850 |
Semiconductor chip with solder joint protection ring |
Jun Zhai, Ranjit Gannamani, Raj N. Master |
2011-04-12 |
| 7633151 |
Integrated circuit package lid with a wetting film |
Seah Sun Too, Jacquana Diep |
2009-12-15 |
| 7544542 |
Reduction of damage to thermal interface material due to asymmetrical load |
Seah Sun Too, Raj N. Master, Jacquana Diep |
2009-06-09 |
| 7513035 |
Method of integrated circuit packaging |
Seah Sun Too, James Hayward, Jacquana Diep |
2009-04-07 |
| 6857790 |
Apparatus and method to vertically route and connect multiple optical fibers |
Edwin Fontecha |
2005-02-22 |
| 6812570 |
Organic packages having low tin solder connections |
Raj N. Master, Maria Guardado, Charles Anderson |
2004-11-02 |
| 6722553 |
Controlled and programmed deposition of flux on a flip-chip die by spraying |
Raj N. Master, Maria Guardado, Ooi T. Ong |
2004-04-20 |
| 6671450 |
Apparatus and method to metallize, reinforce, and hermetically seal multiple optical fibers |
Maria Guardado, Rickquel B. Garcia |
2003-12-30 |
| 6617195 |
Method of reflowing organic packages using no-clean flux |
Raj N. Master, Maria Guardado |
2003-09-09 |
| 6488158 |
Boat for organic and ceramic flip chip package assembly |
Raj N. Master, Maria Guardado, Loo L. Teoh, Ahmad Juwanda |
2002-12-03 |
| 6417563 |
Spring frame for protecting packaged electronic devices |
Jonathan D. Halderman, Alexander C. Tain, Tom Ley |
2002-07-09 |
| 6409070 |
Minimizing flux residue by controlling amount of moisture during reflow |
Raj N. Master, Maria Guardado, Diong Hing Ding, Junaida A. Bakar |
2002-06-25 |
| 6382500 |
Solder reflow furnace with flux effluent collector and method of preventing flux contamination |
Raj N. Master, Maria Guardado, Sp Lee, Sofi Mohd |
2002-05-07 |
| 6371310 |
Boat for land grid array packages |
Raj N. Master, L. K. Teoh |
2002-04-16 |
| 6208027 |
Temporary interconnect for semiconductor devices |
Jerrold L. King |
2001-03-27 |
| 6103549 |
No clean flux for flip chip assembly |
Raj N. Master, Orion K. Starr, Maria Guardado |
2000-08-15 |
| 6098867 |
Automated brush fluxing system for application of controlled amount of flux to packages |
Raj N. Master, Maria Guardado |
2000-08-08 |
| 5988485 |
Flux cleaning for flip chip technology using environmentally friendly solvents |
Raj N. Master, Orion K. Starr |
1999-11-23 |
| 5572692 |
Memory configuration decoding system having automatic row base address generation mechanism for variable memory devices with row access interleaving |
Robert N. Murdoch |
1996-11-05 |
