ML

Min Suet Lim

IN Intel: 78 patents #320 of 30,777Top 2%
Overall (All Time): #22,920 of 4,157,543Top 1%
79
Patents All Time

Issued Patents All Time

Showing 25 most recent of 79 patents

Patent #TitleCo-InventorsDate
12424779 Flexible printed circuit board arrangement Tin Poay Chuah, Jeff Ku, Yew San Lim, Boon Ping Koh 2025-09-23
12396125 Removable fan cartridges for electronic devices Jeff Ku, Mark MacDonald, Tongyan Zhai, Shantanu D. Kulkarni, Arnab Sen +1 more 2025-08-19
12393235 Hinges for electronic devices Jeffrey Ho, Shawn McEuen, Yew San Lim, Bruce C. H. Cheng 2025-08-19
12349276 Co-planar interconnection mechanisms for circuit boards Mooi Ling Chang, Tin Poay Chuah, Eng Huat Goh, Twan Sing Loo 2025-07-01
12341121 Through-substrate underfill formation for an integrated circuit assembly Eng Huat Goh, Kyle Robert Davidson, Kevin Byrd, James A. Wade 2025-06-24
12336145 Vapor chamber with ionized fluid Twan Sing Loo, Jeff Ku, Khai Ern See, Mark Carbone 2025-06-17
12250800 Radiation shield with zipper Yew San Lim, Jeff Ku, Boon Ping Koh, Tin Poay Chuah 2025-03-11
12216306 Computing device with integrated bezel light Surya Pratap Mishra, Shantanu D. Kulkarni 2025-02-04
12204370 Electronic devices with moveable display screens Jeff Ku, Jose Oviedo Salazar, Twan Sing Loo, Khai Ern See 2025-01-21
12167530 Electromagnetic interference shielding enclosure with thermal conductivity Jaejin Lee, James Panakkal, Aiswarya M. Pious 2024-12-10
12146476 Flexible vapor chamber with shape memory material Jeff Ku, Mark Gallina, Jianfang Zhu 2024-11-19
12066833 Computer-assisted or autonomous driving assisted by roadway navigation broadcast Rajashree Baskaran, Maruti Gupta Hyde, Van H. Le, Hebatallah Saadeldeen 2024-08-20
12033953 Electronic device and crosstalk mitigating substrate Tin Poay Chuah, Bok Eng Cheah, Jackson Chung Peng Kong 2024-07-09
11942412 Interposer with flexible portion Bok Eng Cheah, Jackson Chung Peng Kong, Tin Poay Chuah 2024-03-26
11929295 Multi-use package architecture Eng Huat Goh, Jiun Hann Sir, Richard C. Stamey, Chu Aun Lim, Jimin Yao 2024-03-12
11822410 Multi-die stacks with power management Rajashree Baskaran, Maruti Gupta Hyde, Van H. Le, Hebatallah Saadeldeen 2023-11-21
11823994 Systems and apparatuses for implementing a pad on solder mask (POSM) semiconductor substrate package Eng Huat Goh, Jiun Hann Sir 2023-11-21
11798894 Devices and methods for signal integrity protection technique Bok Eng Cheah, Jackson Chung Peng Kong, Khang Choong Yong, Kooi Chi Ooi 2023-10-24
11710029 Methods and apparatus to improve data training of a machine learning model using a field programmable gate array Kooi Chi Ooi, Denica N. Larsen, Lady Nataly Pinilla Pico, Divya Vijayaraghavan 2023-07-25
11699664 Wrappable EMI shields Eng Huat Goh, Tin Poay Chuah, Yew San Lim 2023-07-11
11696409 Vertical embedded component in a printed circuit board blind hole Tin Poay Chuah, Hoay Tien Teoh, Mooi Ling Chang, Chin Lee Kuan 2023-07-04
11664317 Reverse-bridge multi-die interconnect for integrated-circuit packages Eng Huat Goh, MD Altaf Hossain 2023-05-30
11658127 RFI free picture frame metal stiffener Eng Huat Goh, Jiun Hann Sir, Khang Choong Yong, Boon Ping Koh, Wil Choon Song 2023-05-23
11652057 Disaggregated die interconnection with on-silicon cavity bridge Khang Choong Yong, Eng Huat Goh, Robert L. Sankman, Telesphor Kamgaing, Wil Choon Song +1 more 2023-05-16
11639623 Micro-hinge for an electronic device Bok Eng Cheah, Howe Yin Loo, Jackson Chung Peng Kong, Poh Tat Oh 2023-05-02