Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7800916 | Circuitized substrate with internal stacked semiconductor chips, method of making same, electrical assembly utilizing same and information handling system utilizing same | Frank D. Egitto, John M. Lauffer, Voya R. Markovich | 2010-09-21 |
| 7213336 | Hyperbga buildup laminate | David J. Alcoe | 2007-05-08 |
| 6879492 | Hyperbga buildup laminate | David J. Alcoe | 2005-04-12 |
| 6703704 | Stress reducing stiffener ring | David J. Alcoe, Virendra R. Jadhav | 2004-03-09 |
| 6518516 | Multilayered laminate | Frank D. Egitto, Voya R. Markovich, Manh-Quan Nguyen, Douglas O. Powell, David L. Thomas | 2003-02-11 |
| 6337004 | High adhesion performance roll sputtered strike layer | Pei C. Chen, Frank D. Egitto, Allan R. Knoll, George J. Matarese, Luis J. Matienzo | 2002-01-08 |
| 6284329 | Method of forming adherent metal components on a polyimide substrate | Luis J. Matienzo, Frank D. Egitto, Allan R. Knoll | 2001-09-04 |
| 6235411 | Process for coating a substrate with metallic layer | Pei C. Chen, Allan R. Knoll, Luis J. Matienzo, Richard D. Weale | 2001-05-22 |
| 6194076 | Method of forming adherent metal components on a polyimide substrate | Luis J. Matienzo, Frank D. Egitto, Allan R. Knoll | 2001-02-27 |
| 5766499 | Method of making a circuitized substrate | Daniel P. Labzentis, Jonathan D. Reid | 1998-06-16 |
| 5525369 | Method for metallizing through holes in thin film substrates, and resulting devices | Pei C. Chen, Stephen E. Deliman, Allan R. Knoll, George J. Matarese, Richard D. Weale | 1996-06-11 |
| 5461203 | Electronic package including lower water content polyimide film | Pei C. Chen, Frank D. Egitto, Allan R. Knoll, George J. Matarese, Luis J. Matienzo | 1995-10-24 |
| 5372848 | Process for creating organic polymeric substrate with copper | Luis J. Matienzo, Allan R. Knoll | 1994-12-13 |
| 5288541 | Method for metallizing through holes in thin film substrates, and resulting devices | Pei C. Chen, Stephen E. Deliman, Allan R. Knoll, George J. Matarese, Richard D. Weale | 1994-02-22 |
| 4508612 | Shield for improved magnetron sputter deposition into surface recesses | Russell Thomas White, Jr., James Warren Wilson | 1985-04-02 |