Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12385138 | Plasma-enhanced deposition of film stacks | Jason Dirk Haverkamp, Pramod Subramonium, Joseph L. Womack, Dong Niu, John B. Alexy +5 more | 2025-08-12 |
| 12341002 | Low stress films for advanced semiconductor applications | Reza Bayati, Bart J. van Schravendijk, Jonathan Church | 2025-06-24 |
| 11746420 | PECVD apparatus for in-situ deposition of film stacks | Pramod Subramonium, Joseph L. Womack, Dong Niu | 2023-09-05 |
| 11278141 | Garment and hood hanger | Laura Fox | 2022-03-22 |
| 10358717 | Method for depositing high deposition rate, thick tetraethyl orthosilicate film with low compressive stress, high film stability and low shrinkage | Jonathan Church | 2019-07-23 |
| 10214816 | PECVD apparatus for in-situ deposition of film stacks | Jason Dirk Haverkamp, Pramod Subramonium, Joseph L. Womack, Dong Niu, John B. Alexy +5 more | 2019-02-26 |
| 10161034 | Rapid chamber clean using concurrent in-situ and remote plasma sources | Jonathan Church, James Lee, Matthew Mudrow, Kevin Gerber | 2018-12-25 |
| 9388491 | Method for deposition of conformal films with catalysis assisted low temperature CVD | — | 2016-07-12 |
| 9165788 | Post-deposition soft annealing | Bart J. van Schravendijk, Dong Niu, Lucas Benjamin HENDERSON, Joseph L. Womack | 2015-10-20 |
| 9117668 | PECVD deposition of smooth silicon films | Alice Hollister, Sirish Reddy, Mandyam Sriram, Joe Womack | 2015-08-25 |
| 9028924 | In-situ deposition of film stacks | Jason Dirk Haverkamp, Pramod Subramonium, Joe Womack, Dong Niu, John B. Alexy +5 more | 2015-05-12 |
| 8895415 | Tensile stressed doped amorphous silicon | Dong Niu, Joseph L. Womack | 2014-11-25 |
| 8741394 | In-situ deposition of film stacks | Jason Dirk Haverkamp, Pramod Subramonium, Joe Womack, Dong Niu, John B. Alexy +5 more | 2014-06-03 |
| 8709551 | Smooth silicon-containing films | Dong Niu, Joe Womack, Mandyam Sriram, George Andrew Antonelli, Bart J. van Schravendijk +1 more | 2014-04-29 |
| 8591659 | Plasma clean method for deposition chamber | Zhiyuan Fang, Pramod Subramonium, Jon Henri | 2013-11-26 |
| 8563414 | Methods for forming conductive carbon films by PECVD | Dennis M. Hausmann | 2013-10-22 |
| 8173537 | Methods for reducing UV and dielectric diffusion barrier interaction | Kaushik Chattopadhyay, Tom Mountsier, Hui-Jung Wu, Bart J. van Schravendijk, Kimberly Branshaw | 2012-05-08 |
| 8124522 | Reducing UV and dielectric diffusion barrier interaction through the modulation of optical properties | Hui-Jung Wu, Kimberly Shafi, Kaushik Chattopadhyay, Tom Mountsier, Girish Dixit +2 more | 2012-02-28 |
| 7695765 | Methods for producing low-stress carbon-doped oxide films with improved integration properties | Carole Mars, Willis Kirkpatrick, Easwar Srinivasan | 2010-04-13 |
| 7622400 | Method for improving mechanical properties of low dielectric constant materials | Easwar Srinivasan, David Mordo, Qingguo Wu | 2009-11-24 |