| 9406579 |
Semiconductor device and method of controlling warpage in semiconductor package |
DaeSik Choi, Sang Mi Park, WonIl Kwon, YiSu Park |
2016-08-02 |
| 9401289 |
Semiconductor device and method of backgrinding and singulation of semiconductor wafer while reducing kerf shifting and protecting wafer surfaces |
Minjung Kim, KyungHoon Lee, WonIl Kwon, DaeSik Choi |
2016-07-26 |
| 9390945 |
Semiconductor device and method of depositing underfill material with uniform flow rate |
KyungHoon Lee, Sang Mi Park, DaeSik Choi, YiSu Park |
2016-07-12 |
| 9281228 |
Semiconductor device and method of forming thermal interface material and heat spreader over semiconductor die |
DaeSik Choi, Minjung Kim, Sang Mi Park, MinWook Yu |
2016-03-08 |
| 9245772 |
Stackable package by using internal stacking modules |
Choongbin Yim, KeonTeak Kang, YoungChul Kim |
2016-01-26 |
| 9142481 |
Integrated circuit packaging system with heatsink cap and method of manufacture thereof |
Gwangjin Kim, DokOk Yu, Hoon Jung, Jae Han Chung |
2015-09-22 |
| 8710640 |
Integrated circuit packaging system with heat slug and method of manufacture thereof |
DaeSik Choi, Minjung Kim, KyungEun KIM |
2014-04-29 |
| 8598034 |
Package-on-package system with through vias and method of manufacture thereof |
DongSam Park |
2013-12-03 |
| 8476775 |
Integrated circuit packaging system with embedded interconnect and method of manufacture thereof |
YoungSik Cho, Sunghyun Lee |
2013-07-02 |
| 8035210 |
Integrated circuit package system with interposer |
Dongjin Jung, In Sang Yoon |
2011-10-11 |
| 7986048 |
Package-on-package system with through vias and method of manufacture thereof |
DongSam Park |
2011-07-26 |
| 7901987 |
Package-on-package system with internal stacking module interposer |
Dongjin Jung |
2011-03-08 |
| 7804166 |
Integrated circuit package system with stacking module |
YoungSik Cho, Nam Ju Cho |
2010-09-28 |
| 7800211 |
Stackable package by using internal stacking modules |
Choongbin Yim, KeonTeak Kang, YoungChul Kim |
2010-09-21 |
| 7482203 |
Stacked integrated circuit package-in-package system |
Sungmin Song, Choong Bin Yim, Seongmin Lee, Jaehyun LIM, DongSam Park |
2009-01-27 |
| 7312519 |
Stacked integrated circuit package-in-package system |
Sungmin Song, Choong Bin Yim, Seongmin Lee, Jaehyun LIM, DongSam Park |
2007-12-25 |
| 7298037 |
Stacked integrated circuit package-in-package system with recessed spacer |
Choong Bin Yim, Sungmin Song, Seongmin Lee, Jaehyun LIM, DongSam Park |
2007-11-20 |