Issued Patents All Time
Showing 25 most recent of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142544 | Semiconductor package | Taehwan Kim, Young-Deuk Kim, Kyung Suk Oh, Eungchang Lee | 2024-11-12 |
| 12125766 | Thermoelectric cooling packages | Tae Hwan Kim, Kyung Suk Oh | 2024-10-22 |
| 11756850 | Chip on film package and display device including the same | Seung-Tae Hwang, Kyung Suk Oh, Woon-bae Kim, Jae-Min Jung | 2023-09-12 |
| 11600608 | Semiconductor package | Jichul Kim, Chajea Jo, Sang-Uk Han, Kyoung Soon Cho, Woohyun Park | 2023-03-07 |
| 11502059 | Semiconductor package including a thermal pillar and heat transfer film | Heejung Hwang, Yun-Seok Choi | 2022-11-15 |
| 11205604 | Semiconductor package including a thermal conductive layer and method of manufacturing the same | Woo Hyun Park, Eon Soo Jang, Young-Sang Cho | 2021-12-21 |
| 11107743 | Chip on film package and display device including the same | Seung-Tae Hwang, Kyung Suk Oh, Woon-bae Kim, Jae-Min Jung | 2021-08-31 |
| 11004760 | Chip structure operating method including heating elements to reduce temperature variation | Woo Hyun Park | 2021-05-11 |
| 10985152 | Semiconductor package | Jichul Kim, Chajea Jo, Sang-Uk Han, Kyoung Soon Cho, Woohyun Park | 2021-04-20 |
| 10937771 | Semiconductor packages | Jichul Kim, Hansung Ryu, KyongSoon Cho, Youngsang Cho, Yeo-Hoon Yoon | 2021-03-02 |
| 10879294 | Image sensor package having multi-level stack structure | Yong Hoon Kim, Ji-Chul Kim, Seung-Yong Cha | 2020-12-29 |
| 10879225 | Semiconductor package and method of manufacturing semiconductor package | Won Keun Kim, Kyung Suk Oh, Hwa-il Jin, Dong Kwan Kim, Yeong Seok Kim +1 more | 2020-12-29 |
| 10790213 | Heat radiation device, semiconductor package comprising the same, and semiconductor device comprising the same | Young-Deuk Kim, Younghoon Hyun | 2020-09-29 |
| 10707196 | Electronic device and method of manufacturing the electronic device | Young-Deuk Kim, Woo Hyun Park | 2020-07-07 |
| 10658266 | Thermoelectric cooling packages and thermal management methods thereof | Jichul Kim, Jin-Kwon Bae, Eunseok Cho | 2020-05-19 |
| 10553513 | Chip structure including heating element | Woo Hyun Park | 2020-02-04 |
| 10546844 | Stack package and method of manufacturing the stack package | Eon Soo Jang, Eun-Hee Jung, Hyon-chol Kim, Byeong-Yeon Cho | 2020-01-28 |
| 10541263 | Image sensor package having multi-level stack structure | Yong Hoon Kim, Ji-Chul Kim, Seung-Yong Cha | 2020-01-21 |
| 10510737 | Semiconductor package | Jichul Kim, Chajea Jo, Sang-Uk Han, Kyoung Soon Cho, Woohyun Park | 2019-12-17 |
| 10347611 | Semiconductor packages having redistribution substrate | Jichul Kim, Hansung Ryu, KyongSoon Cho, Youngsang Cho, Yeo-Hoon Yoon | 2019-07-09 |
| 10198049 | Surface temperature management method of mobile device and memory thermal management method of multichip package | Heungkyu Kwon, Eunseok Cho, Jichul Kim | 2019-02-05 |
| 9991245 | Semiconductor packages with heat dissipation layers and pillars and methods for fabricating the same | Donghan Kim, Jikho Song, Mitsuo Umemoto, Inho Choi | 2018-06-05 |
| 9704815 | Package substrate and semiconductor package including the same | Mi-Na Choi, Young-Deuk Kim, Eon Soo Jang, Hee-Jung Hwang | 2017-07-11 |
| 9679874 | Semiconductor package and semiconductor device including the same | Jin-Kwon Bae, Jichul Kim, Kyol Park, Chajea Jo | 2017-06-13 |
| 9671141 | Thermoelectric cooling packages and thermal management methods thereof | Jichul Kim, Jin-Kwon Bae, Eunseok Cho | 2017-06-06 |