Issued Patents All Time
Showing 1–25 of 119 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11541472 | Ultrasonic-assisted solder transfer | Jae-Woong Nah, Stephen L. Buchwalter, Peter A. Gruber, Paul A. Lauro | 2023-01-03 |
| 11270966 | Combination polyimide decal with a rigid mold | Jae-Woong Nah, Stephen L. Buchwalter, Peter A. Gruber, Paul A. Lauro | 2022-03-08 |
| 11257767 | Interconnect crack arrestor structure and methods | Chen-Hua Yu | 2022-02-22 |
| 11110534 | Continuous solder transfer to substrates | Jae-Woong Nah, Stephen L. Buchwalter, Peter A. Gruber, Paul A. Lauro | 2021-09-07 |
| 10833120 | Injection molded microoptics | Lawrence Jacobowitz, Stephen L. Buchwalter, Casimer M. DeCusatis, Peter A. Gruber | 2020-11-10 |
| 10490594 | Injection molded microoptics | Lawrence Jacobwitz, Stephen L. Buchwalter, Casimer M. DeCusatis, Peter A. Gruber | 2019-11-26 |
| 10340226 | Interconnect crack arrestor structure and methods | Chen-Hua Yu | 2019-07-02 |
| 10034390 | Metal post bonding using pre-fabricated metal posts | Yi-Li Hsiao, Su-Chun Yang, Chih-Hang Tung, Chen-Hua Yu | 2018-07-24 |
| 9978709 | Solder bump stretching method for forming a solder bump joint in a device | Su-Chun Yang, Chung-Jung Wu, Hsiao-Yun Chen, Yi-Li Hsiao, Chih-Hang Tung +1 more | 2018-05-22 |
| 9679882 | Method of multi-chip wafer level packaging | Chih-Hang Tung, Chun-Hui Yu, Chen-Hua Yu | 2017-06-13 |
| 9679875 | Reduced volume interconnect for three-dimensional chip stack | Peter A. Gruber, Katsuyuki Sakuma | 2017-06-13 |
| 9543273 | Reduced volume interconnect for three-dimensional chip stack | Peter A. Gruber, Katsuyuki Sakuma | 2017-01-10 |
| 9521795 | Two-step direct bonding processes and tools for performing the same | Yi-Li Hsiao, Chih-Hang Tung, Chen-Hua Yu | 2016-12-13 |
| 9490408 | Injection molded microoptics | Lawrence Jacobowitz, Stephen L. Buchwalter, Casimer M. DeCusatis, Peter A. Gruber | 2016-11-08 |
| 9475145 | Solder bump joint in a device including lamellar structures | Su-Chun Yang, Chung-Jung Wu, Hsiao-Yun Chen, Yi-Li Hsiao, Chih-Hang Tung +1 more | 2016-10-25 |
| 9404942 | Coaxial probe structure of elongated electrical conductors projecting from a support structure | Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Yun-Hsin Liao, Daniel Peter Morris | 2016-08-02 |
| 9343423 | No flow underfill or wafer level underfill and solder columns | Claudius Ferger, Michael A. Gaynes, Jae-Woong Nah | 2016-05-17 |
| 9305896 | No flow underfill or wafer level underfill and solder columns | Claudius Ferger, Michael A. Gaynes, Jae-Woong Nah | 2016-04-05 |
| 9263407 | Method for manufacturing a plurality of metal posts | Yi-Li Hsiao, Su-Chun Yang, Chih-Hang Tung, Chen-Hua Yu | 2016-02-16 |
| 9252120 | Copper post solder bumps on substrates | Jae-Woong Nah | 2016-02-02 |
| 9230932 | Interconnect crack arrestor structure and methods | Chen-Hua Yu | 2016-01-05 |
| 9216469 | Indirect printing bumping method for solder ball deposition | Yi-Li Hsiao, Chih-Hang Tung, Chen-Hua Yu | 2015-12-22 |
| 9082762 | Electromigration-resistant under-bump metallization of nickel-iron alloys for Sn-rich solder bumps in Pb-free flip-clip | Sung Kwon Kang, Paul A. Lauro, Minhua Lu | 2015-07-14 |
| 9082763 | Joint structure for substrates and methods of forming | Chen-Hua Yu, Chih-Hang Tung | 2015-07-14 |
| 9012266 | Copper post solder bumps on substrates | Jae-Woong Nah | 2015-04-21 |