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Method for forming a handling substrate for a composite structure intended for RF applications and handling substrate |
Young-Pil Kim, Luciana Capello, Isabelle Bertrand, Frédéric Allibert |
2025-07-15 |
| 12101080 |
Heterostructure and method of fabrication |
Arnaud Castex, Bernard Aspar, Ionut Radu |
2024-09-24 |
| 11637542 |
Heterostructure and method of fabrication |
Arnaud Castex, Bernard Aspar, Ionut Radu |
2023-04-25 |
| 11595020 |
Heterostructure and method of fabrication |
Arnaud Castex, Bernard Aspar, Ionut Radu |
2023-02-28 |
| 11373898 |
Method for manufacturing a semiconductor on insulator type structure by layer transfer |
Damien Parissi, Marcel Broekaart |
2022-06-28 |
| 11205702 |
Method for manufacturing a structure for forming a tridimensional monolithic integrated circuit |
Christophe Figuet, Ludovic Ecarnot, Bich-Yen Nguyen, Walter Schwarzenbach, Ionut Radu |
2021-12-21 |
| 10826459 |
Heterostructure and method of fabrication |
Arnaud Castex, Bernard Aspar, Ionut Radu |
2020-11-03 |
| 9716029 |
Method for transferring a layer of a semiconductor and substrate comprising a confinement structure |
Fabrice Lallement, Christophe Figuet |
2017-07-25 |
| 9293473 |
Method for manufacturing a semiconductor on insulator structure having low electrical losses |
Patrick Reynaud, Sebastien Kerdiles |
2016-03-22 |
| 8962450 |
Method for manufacturing a semiconductor-on-insulator structure having low electrical losses |
Patrick Reynaud, Sebastien Kerdiles |
2015-02-24 |
| 8946053 |
Method for reducing irregularities at the surface of a layer transferred from a source substrate to a glass-based support substrate |
Carine Duret, Nadia Ben-Mohamed, Fabrice Lallement |
2015-02-03 |
| 8790993 |
Method for molecular bonding of silicon and glass substrates |
Sebastien Kerdiles |
2014-07-29 |
| 8772875 |
Semiconductor on glass substrate with stiffening layer |
Nadia Ben Mohamed, Ta-Ko Chuang, Jeffrey Scott Cites, Alexander Usenko |
2014-07-08 |
| 8658514 |
Method for manufacturing a semiconductor-on-insulator structure having low electrical losses, and corresponding structure |
Patrick Reynaud, Sebastien Kerdiles |
2014-02-25 |
| 8580654 |
Method for molecular bonding of silicon and glass substrates |
Sebastien Kerdiles |
2013-11-12 |
| 8518799 |
Process of making semiconductor on glass substrates with a stiffening layer |
Nadia Ben Mohamed, Ta-Ko Chuang, Jeffrey Scott Cites, Alex Usenko |
2013-08-27 |
| 8357974 |
Semiconductor on glass substrate with stiffening layer and process of making the same |
Nadia Ben Mohamed, Ta-Ko Chuang, Jeffrey Scott Cites, Alex Usenko |
2013-01-22 |
| 8349703 |
Method of bonding two substrates |
Sebastien Kerdiles, Willy Michel, Walter Schwarzenbach, Nadia Ben Mohamed |
2013-01-08 |
| 7919391 |
Methods for preparing a bonding surface of a semiconductor wafer |
Cecile Delattre, Frederic Metral, Christophe Maleville |
2011-04-05 |
| 7645682 |
Bonding interface quality by cold cleaning and hot bonding |
Sebastien Kerdiles, Willy Michel, Walter Schwarzenbach |
2010-01-12 |
| 7485545 |
Method of configuring a process to obtain a thin layer with a low density of holes |
Nadia Ben Mohamed, Eric Neyret |
2009-02-03 |
| 7405136 |
Methods for manufacturing compound-material wafers and for recycling used donor substrates |
Eric Neyret, Oleg Kononchuk, Patrick Reynaud, Michael Stinco |
2008-07-29 |
| 6563631 |
Tunable gain-clamped semiconductor optical amplifier |
Guilhem Alibert |
2003-05-13 |
| 6459158 |
Vertically-tolerant alignment using slanted wall pedestal |
Manuel Fendler, Anatolie Lupu |
2002-10-01 |