| 12198896 |
Compact high density plasma source |
Roger Patrick, Neil Benjamin, Lee Chen, Alan M. Schoepp, Thomas W. Anderson +1 more |
2025-01-14 |
| 9287110 |
Method and apparatus for wafer electroless plating |
William Thie, John M. Boyd, Fritz Redeker, Yezdi Dordi, John Parks +5 more |
2016-03-15 |
| 8844461 |
Fluid handling system for wafer electroless plating and associated methods |
William Thie, John M. Boyd, Fritz Redeker, Yezdi Dordi, John Parks +5 more |
2014-09-30 |
| 8555903 |
Method and apparatus for removing contamination from substrate |
Erik M. Freer, John M. de Larios, Katrina Mikhaylichenko, Michael Ravkin, Mikhail Korolik +2 more |
2013-10-15 |
| 8522799 |
Apparatus and system for cleaning a substrate |
Erik M. Freer, John M. de Larios, Katrina Mikhaylichenko, Michael Ravkin, Mikhail Korolik +2 more |
2013-09-03 |
| 8485120 |
Method and apparatus for wafer electroless plating |
William Thie, John M. Boyd, Fritz Redeker, Yezdi Dordi, John Parks +5 more |
2013-07-16 |
| 8314027 |
Wafer electroless plating system and associated methods |
William Thie, John M. Boyd, Fritz Redeker, Yezdi Dordi, John Parks +5 more |
2012-11-20 |
| 8069813 |
Wafer electroless plating system and associated methods |
William Thie, John M. Boyd, Fritz Redeker, Yezdi Dordi, John Parks +5 more |
2011-12-06 |
| 7648584 |
Method and apparatus for removing contamination from substrate |
Erik M. Freer, John M. de Larios, Katrina Mikhaylichenko, Michael Ravkin, Mikhail Korolik +2 more |
2010-01-19 |
| 6367357 |
Positive engagement spanner wrench |
— |
2002-04-09 |
