Issued Patents All Time
Showing 25 most recent of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11908819 | Semiconductor packaging substrate fine pitch metal bump and reinforcement structures | Jun Chung Hsu, Jun Zhai, Yifan Kao, Young Doo Jeon, Taegui Kim | 2024-02-20 |
| 11545455 | Semiconductor packaging substrate fine pitch metal bump and reinforcement structures | Jun Chung Hsu, Jun Zhai, Yifan Kao, Young Doo Jeon, Taegui Kim | 2023-01-03 |
| 9754924 | Fan-out pop stacking process | — | 2017-09-05 |
| 9601464 | Thermally enhanced package-on-package structure | — | 2017-03-21 |
| 9583472 | Fan out system in package and method for forming the same | Jun Zhai, Yizhang Yang | 2017-02-28 |
| 9452591 | Tempered glass screen protector applied to a portable electronic device | Hsing-Chiao Lin, YUH-CHANG LAN | 2016-09-27 |
| 9379097 | Fan-out PoP stacking process | — | 2016-06-28 |
| 9263426 | PoP structure with electrically insulating material between packages | Jie Zhao, Yizhang Yang, Jun Zhai | 2016-02-16 |
| 9067813 | Forming mold and related forming device and forming method using same | Jung-Pin Hsu, Tai-Hua Lee, Chao-Hsien Lee | 2015-06-30 |
| 8963311 | PoP structure with electrically insulating material between packages | Jie Zhao, Yizhang Yang, Jun Zhai | 2015-02-24 |
| 8889488 | Method for manufacturing semiconductor package | Shin-Hua Chao, Chao-Yuan Liu, Hui-Ying Hsieh | 2014-11-18 |
| 8766424 | Thin substrate PoP structure | — | 2014-07-01 |
| 8546950 | Semiconductor package and manufacturing method thereof | Shin-Hua Chao, Chao-Yuan Liu, Hui-Ying Hsieh | 2013-10-01 |
| 8546932 | Thin substrate PoP structure | — | 2013-10-01 |
| 8384204 | Circuit carrier and semiconductor package using the same | Chien Liu | 2013-02-26 |
| 7902650 | Semiconductor package and method for manufacturing the same | Chia Chien Hu, Chao Liu, Chien Liu | 2011-03-08 |
| 7834469 | Stacked type chip package structure including a chip package and a chip that are stacked on a lead frame | Yao-Kai Chuang, Chien Liu, Chao Liu | 2010-11-16 |
| 7565737 | Manufacturing method of package substrate | — | 2009-07-28 |
| 7482200 | Process for fabricating chip package structure | — | 2009-01-27 |
| 7375435 | Chip package structure | Meng-Jen Wang | 2008-05-20 |
| 7327018 | Chip package structure, package substrate and manufacturing method thereof | — | 2008-02-05 |
| 7262510 | Chip package structure | — | 2007-08-28 |
| 7163840 | Flip chip package and manufacturing method thereof | Yu-Wen Chen, Chi-Hao Chiu | 2007-01-16 |
| 7125745 | Multi-chip package substrate for flip-chip and wire bonding | Kun-Ching Chen, Yi Ding, Po-Jen Cheng, Yun-Hsiang Tien | 2006-10-24 |
| 7098071 | Method for flip chip bonding by utilizing an interposer with embedded bumps | Ming-Lun Ho | 2006-08-29 |