Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400989 | Arrangement of power-grounds in package structures | Ting-Yu Yeh, Fong-Yuan Chang, Jyh Chwen Frank Lee | 2025-08-26 |
| 11929340 | Arrangement of power-grounds in package structures | Ting-Yu Yeh, Fong-Yuan Chang, Jyh Chwen Frank Lee | 2024-03-12 |
| 11545392 | Semiconductor component having through-silicon vias | Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang +4 more | 2023-01-03 |
| 11183399 | Semiconductor device and method of manufacture | Wen-Hsin Wei, Hsien-Pin Hu, Shang-Yun Hou, Chi-Hsi Wu, Chen-Hua Yu +6 more | 2021-11-23 |
| 11101140 | Semiconductor device and method of manufacture | Wen-Hsin Wei, Hsien-Pin Hu, Shang-Yun Hou, Chi-Hsi Wu, Chen-Hua Yu +6 more | 2021-08-24 |
| 10784162 | Method of making a semiconductor component having through-silicon vias | Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang +4 more | 2020-09-22 |
| 10262939 | Configurable routing for packaging applications | Chung-Yu Lu, Hsien-Pin Hu, Shin-Puu Jeng, Shang-Yun Hou, Tzuan-Horng Liu +1 more | 2019-04-16 |
| 10153338 | Method of manufacturing a capacitor | Der-Chyang Yeh, Kuang-Wei Cheng, Yuan-Hung Liu, Shang-Yun Hou, Wen-Chih Chiou +1 more | 2018-12-11 |
| 10115634 | Semiconductor component having through-silicon vias and method of manufacture | Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang +4 more | 2018-10-30 |
| 10050103 | Method of forming semiconductor structures including metal insulator metal capacitor | Fang-Ting Kuo, Ren-Wei Xiao, Sheng-Yu Lin, Chia-Wei Liu, Chien-Ying Wu | 2018-08-14 |
| 9666660 | Semiconductor structures including metal insulator metal capacitor | Fang-Ting Kuo, Ren-Wei Xiao, Sheng-Yu Lin, Chia-Wei Liu, Chien-Ying Wu | 2017-05-30 |
| 9660016 | Method of manufacturing a capacitor | Der-Chyang Yeh, Kuang-Wei Cheng, Yuan-Hung Liu, Shang-Yun Hou, Wen-Chih Chiou +1 more | 2017-05-23 |
| 9530730 | Configurable routing for packaging applications | Chung-Yu Lu, Hsien-Pin Hu, Shin-Puu Jeng, Shang-Yun Hou, Tzuan-Horng Liu +1 more | 2016-12-27 |
| 9418923 | Semiconductor component having through-silicon vias and method of manufacture | Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang +4 more | 2016-08-16 |
| 8895385 | Methods of forming semiconductor structures | Sung-Hui Huang, Der-Chyang Yeh | 2014-11-25 |
| 8890224 | Semiconductor structures having a metal-insulator-metal capacitor structure | Sung-Hui Huang, Der-Chyang Yeh | 2014-11-18 |
| 8878338 | Capacitor for interposers and methods of manufacture thereof | Der-Chyang Yeh, Kuang-Wei Cheng, Yuan-Hung Liu, Shang-Yun Hou, Wen-Chih Chiou +1 more | 2014-11-04 |
| 8765549 | Capacitor for interposers and methods of manufacture thereof | Shin-Puu Jeng, Der-Chyang Yeh, Shang-Yun Hou, Wen-Chih Chiou | 2014-07-01 |
| 8575725 | Through-silicon vias for semicondcutor substrate and method of manufacture | Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang +4 more | 2013-11-05 |
| 8552485 | Semiconductor structure having metal-insulator-metal capacitor structure | Sung-Hui Huang, Der-Chyang Yeh | 2013-10-08 |
| 8487410 | Through-silicon vias for semicondcutor substrate and method of manufacture | Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang +4 more | 2013-07-16 |