Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10050103 | Method of forming semiconductor structures including metal insulator metal capacitor | Fang-Ting Kuo, Sheng-Yu Lin, Chia-Wei Liu, Chun Hua Chang, Chien-Ying Wu | 2018-08-14 |
| 9984971 | Methods of forming metal pad structures over TSVS to reduce shorting of upper metal layers | Chung-Chuan Tseng, Chia-Wei Liu, Fang-Ting Kuo | 2018-05-29 |
| 9666660 | Semiconductor structures including metal insulator metal capacitor | Fang-Ting Kuo, Sheng-Yu Lin, Chia-Wei Liu, Chun Hua Chang, Chien-Ying Wu | 2017-05-30 |
| 9530690 | Metal pad structure over TSV to reduce shorting of upper metal layer | Chung-Chuan Tseng, Chia-Wei Liu, Cindy Kuo | 2016-12-27 |
| 9177914 | Metal pad structure over TSV to reduce shorting of upper metal layer | Chung-Chuan Tseng, Chia-Wei Liu, Cindy Kuo | 2015-11-03 |