Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9530690 | Metal pad structure over TSV to reduce shorting of upper metal layer | Chung-Chuan Tseng, Chia-Wei Liu, Ren-Wei Xiao | 2016-12-27 |
| 9177914 | Metal pad structure over TSV to reduce shorting of upper metal layer | Chung-Chuan Tseng, Chia-Wei Liu, Ren-Wei Xiao | 2015-11-03 |