Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8668834 | Protecting a mold having a substantially planar surface provided with a plurality of mold cavities | Sarah H. Knickerbocker, Richard P. Volant | 2014-03-11 |
| 7480538 | Methods, systems, and computer program products for managing movement of work-in-process materials in an automated manufacturing environment | Richard P. Volant, Sameer T. Shikalgar, Michael J. Toner, Yutong Wu | 2009-01-20 |
| 7369911 | Methods, systems, and computer program products for managing movement of work-in-process materials in an automated manufacturing environment | Richard P. Volant, Sameer T. Shikalgar, Michael J. Toner, Yutong Wu | 2008-05-06 |
| 7208414 | Method for enhanced uni-directional diffusion of metal and subsequent silicide formation | Anthony G. Domenicucci, Christian Lavoie, Robert J. Purtell, Yun-Yu Wang, Kwong Hon Wong | 2007-04-24 |
| 7129169 | Method for controlling voiding and bridging in silicide formation | Christian Lavoie, Robert J. Purtell, Yun-Yu Wang, Keith Kwong Hon Wong | 2006-10-31 |
| 6497784 | Semiconductor wafer edge bead removal method and tool | Viraj Y. Sardesai | 2002-12-24 |
| 6344414 | Chemical-mechanical polishing system having a bi-material wafer backing film assembly | Kenneth M. Davis, Fen F. Jamin, Michael F. Lofaro | 2002-02-05 |
| 6171513 | Chemical-mechanical polishing system having a bi-material wafer backing film and two-piece wafer carrier | Kenneth M. Davis, Ralph R. Comulada, Jr., Fen F. Jamin, Francis R. Krug, Jr., Michael F. Lofaro | 2001-01-09 |
| 6117778 | Semiconductor wafer edge bead removal method and tool | Viraj Y. Sardesai | 2000-09-12 |
| 6060388 | Conductors for microelectronic circuits and method of manufacture | Hiroyuki Akatsu, Russell H. Arndt, George F. Ouimet | 2000-05-09 |
| 5985768 | Method of forming a semiconductor | Anthony C. Speranza | 1999-11-16 |