Issued Patents All Time
Showing 376–400 of 404 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6234870 | Serial intelligent electro-chemical-mechanical wafer processor | Daniel C. Edelstein | 2001-05-22 |
| 6235406 | Copper film including laminated impurities | — | 2001-05-22 |
| 6228231 | Electroplating workpiece fixture having liquid gap spacer | — | 2001-05-08 |
| 6217734 | Electroplating electrical contacts | — | 2001-04-17 |
| 6193861 | Apparatus and method to enhance hole fill in sub-micron plating | — | 2001-02-27 |
| 6181012 | Copper interconnection structure incorporating a metal seed layer | Daniel C. Edelstein, James M. E. Harper, Chao-Kun Hu, Andrew H. Simon | 2001-01-30 |
| 6180505 | Process for forming a copper-containing film | — | 2001-01-30 |
| 6168693 | Apparatus for controlling the uniformity of an electroplated workpiece | Gerard Landry | 2001-01-02 |
| 6140234 | Method to selectively fill recesses with conductive metal | Stephen E. Greco | 2000-10-31 |
| 6126806 | Enhancing copper electromigration resistance with indium and oxygen lamination | — | 2000-10-03 |
| 6123825 | Electromigration-resistant copper microstructure and process of making | Steven H. Boettcher, Patrick W. DeHaven, Christopher C. Parks, Andrew H. Simon | 2000-09-26 |
| 6117784 | Process for integrated circuit wiring | — | 2000-09-12 |
| 6114937 | Integrated circuit spiral inductor | Joachim Norbert Burghartz, Daniel C. Edelstein, Christopher V. Jahnes | 2000-09-05 |
| 6113769 | Apparatus to monitor and add plating solution of plating baths and controlling quality of deposited metal | Wilma Jean Horkans, Panayotis Andricacos | 2000-09-05 |
| 6113759 | Anode design for semiconductor deposition having novel electrical contact assembly | — | 2000-09-05 |
| 6103096 | Apparatus and method for the electrochemical etching of a wafer | Madhav Datta, Daniel C. Edelstein | 2000-08-15 |
| 6090710 | Method of making copper alloys for chip and package interconnections | Panayotis Andricacos, Hariklia Deligianni, James M. E. Harper, Chao-Kun Hu, Dale J. Pearson +2 more | 2000-07-18 |
| 6071388 | Electroplating workpiece fixture having liquid gap spacer | — | 2000-06-06 |
| 6066030 | Electroetch and chemical mechanical polishing equipment | — | 2000-05-23 |
| 6063506 | Copper alloys for chip and package interconnections | Panayotis Andricacos, Hariklia Deligianni, James M. E. Harper, Chao-Kun Hu, Dale J. Pearson +2 more | 2000-05-16 |
| 6056869 | Wafer edge deplater for chemical mechanical polishing of substrates | — | 2000-05-02 |
| 6054329 | Method of forming an integrated circuit spiral inductor with ferromagnetic liner | Joachim Norbert Burghartz, Daniel C. Edelstein, Christopher V. Jahnes | 2000-04-25 |
| 5933753 | Open-bottomed via liner structure and method for fabricating same | Andrew H. Simon | 1999-08-03 |
| 5930669 | Continuous highly conductive metal wiring structures and method for fabricating the same | — | 1999-07-27 |
| 5911619 | Apparatus for electrochemical mechanical planarization | James M. E. Harper | 1999-06-15 |