Issued Patents All Time
Showing 251–275 of 404 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9076594 | Capacitors using porous alumina structures | Rajesh Katkar | 2015-07-07 |
| 9070676 | Bowl-shaped solder structure | Rajesh Katkar | 2015-06-30 |
| 9064933 | Methods and structure for carrier-less thin wafer handling | Pezhman Monadgemi, Michael Newman, Charles G. Woychik, Terrence Caskey | 2015-06-23 |
| 9030017 | Z-connection using electroless plating | Belgacem Haba | 2015-05-12 |
| 9024205 | Advanced device assembly structures and methods | — | 2015-05-05 |
| 9000600 | Reduced stress TSV and interposer structures | Charles G. Woychik, Terrence Caskey, Kishor Desai, Huailiang Wei, Craig Mitchell +1 more | 2015-04-07 |
| 8978247 | TSV fabrication using a removable handling structure | Se Young Yang, Michael Van Huynh, Rajesh Katkar | 2015-03-17 |
| 8981564 | Metal PVD-free conducting structures | Charles G. Woychik, Michael Newman, Pezhman Monadgemi, Terrence Caskey | 2015-03-17 |
| 8975751 | Vias in porous substrates | Ilyas Mohammed, Belgacem Haba, Piyush Savalia | 2015-03-10 |
| 8963335 | Tunable composite interposer | Charles G. Woychik, Hiroaki Sato | 2015-02-24 |
| 8946899 | Via in substrate with deposited layer | — | 2015-02-03 |
| 8916781 | Cavities containing multi-wiring structures and devices | Belgacem Haba, Ilyas Mohammed, Craig Mitchell | 2014-12-23 |
| 8884427 | Low CTE interposer without TSV structure | Charles G. Woychik, Michael Newman, Terrence Caskey | 2014-11-11 |
| 8846447 | Thin wafer handling and known good die test method | Charles G. Woychik, Se Young Yang, Pezhman Monadgemi, Terrence Caskey | 2014-09-30 |
| 8829680 | Reliable packaging and interconnect structures | Belgacem Haba, Craig Mitchell | 2014-09-09 |
| 8816505 | Low stress vias | Ilyas Mohammed, Belgacem Haba | 2014-08-26 |
| 8785790 | High strength through-substrate vias | Charles G. Woychik, Terrence Caskey, Belgacem Haba, Hiroaki Sato, Philip Damberg | 2014-07-22 |
| 8772946 | Reduced stress TSV and interposer structures | Charles G. Woychik, Terrence Caskey, Kishor Desai, Huailiang Wei, Craig Mitchell +1 more | 2014-07-08 |
| 8757897 | Optical interposer | Valentin Kosenko, Edward Lee McBain, Pezhman Monadgemi, Sergey Savastiouk | 2014-06-24 |
| 8742541 | High density three-dimensional integrated capacitors | Ilyas Mohammed, Belgacem Haba, Piyush Savalia, Vage Oganesian | 2014-06-03 |
| 8728934 | Systems and methods for producing flat surfaces in interconnect structures | Vage Oganesian, Ilyas Mohammed | 2014-05-20 |
| 8692118 | Reliable wire structure and method | Craig Mitchell | 2014-04-08 |
| 8609540 | Reliable packaging and interconnect structures | Belgacem Haba, Craig Mitchell | 2013-12-17 |
| 8076237 | Method and apparatus for 3D interconnect | — | 2011-12-13 |
| 7704880 | Method of forming contact layers on substrates | Bulent M. Basol, Hung-Ming Wang, Homayoun Talieh | 2010-04-27 |