Issued Patents All Time
Showing 226–250 of 404 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9379008 | Metal PVD-free conducting structures | Charles G. Woychik, Michael Newman, Pezhman Monadgemi, Terrence Caskey | 2016-06-28 |
| 9373585 | Polymer member based interconnect | Rajesh Katkar, Charles G. Woychik, Guilian Gao, Arkalgud R. Sitaram | 2016-06-21 |
| 9368479 | Thermal vias disposed in a substrate proximate to a well thereof | Rajesh Katkar, Arkalgud R. Sitaram | 2016-06-14 |
| 9365947 | Method for preparing low cost substrates | Sitaram Arkalgud | 2016-06-14 |
| 9362204 | Tunable composite interposer | Charles G. Woychik, Hiroaki Sato | 2016-06-07 |
| 9355905 | Methods and structure for carrier-less thin wafer handling | Pezhman Monadgemi, Michael Newman, Charles G. Woychik, Terrence Caskey | 2016-05-31 |
| 9349669 | Reduced stress TSV and interposer structures | Charles G. Woychik, Terrence Caskey, Kishor Desai, Huailiang Wei, Craig Mitchell +1 more | 2016-05-24 |
| 9349614 | Device and method for localized underfill | Liang Wang, Rajesh Katkar, Charles G. Woychik | 2016-05-24 |
| 9331043 | Localized sealing of interconnect structures in small gaps | Rajesh Katkar, Arkalgud R. Sitaram | 2016-05-03 |
| 9323010 | Structures formed using monocrystalline silicon and/or other materials for optical and other applications | Valentin Kosenko, Edward Lee McBain, Pezhman Monadgemi, Sergey Savastiouk | 2016-04-26 |
| 9318385 | Systems and methods for producing flat surfaces in interconnect structures | Vage Oganesian, Ilyas Mohammed | 2016-04-19 |
| 9287164 | Single exposure in multi-damascene process | Vage Oganesian, Ilyas Mohammed, Craig Mitchell, Belgacem Haba | 2016-03-15 |
| 9263394 | Multiple bond via arrays of different wire heights on a same substrate | Rajesh Katkar | 2016-02-16 |
| 9257396 | Compact semiconductor package and related methods | — | 2016-02-09 |
| 9245670 | Reliable wire method | Craig Mitchell | 2016-01-26 |
| 9237648 | Carrier-less silicon interposer | Michael Newman, Charles G. Woychik, Pezhman Monadgemi, Terrence Caskey | 2016-01-12 |
| 9226396 | Porous alumina templates for electronic packages | Rajesh Katkar, Belgacem Haba, Ilyas Mohammed | 2015-12-29 |
| 9214425 | Low-stress vias | Ilyas Mohammed, Belgacem Haba | 2015-12-15 |
| 9190463 | High density three-dimensional integrated capacitors | Ilyas Mohammed, Belgacem Haba, Piyush Savalia, Vage Oganesian | 2015-11-17 |
| 9184323 | Method and substrates for making photovoltaic cells | Emeka Nchekwube | 2015-11-10 |
| 9142508 | Single exposure in multi-damascene process | Vage Oganesian, Ilyas Mohammed, Craig Mitchell, Belgacem Haba | 2015-09-22 |
| 9125333 | Electrical barrier layers | Vage Oganesian, Ilyas Mohammed, Belgacem Haba, Piyush Savalia, Craig Mitchell | 2015-09-01 |
| 9123780 | Method and structures for heat dissipating interposers | Pezhman Monadgemi, Terrence Caskey, Fatima Lina Ayatollahi, Belgacem Haba, Charles G. Woychik +1 more | 2015-09-01 |
| 9123703 | Systems and methods for producing flat surfaces in interconnect structures | Vage Oganesian, IIyas Mohammed | 2015-09-01 |
| 9076785 | Method and structures for via substrate repair and assembly | — | 2015-07-07 |