Issued Patents All Time
Showing 276–300 of 404 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7670473 | Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same | Bulent M. Basol | 2010-03-02 |
| RE40983 | Method to plate C4 to copper stud | Daniel C. Edelstein | 2009-11-17 |
| 7572354 | Electrochemical processing of conductive surface | Homayoun Talieh, Bulent M. Basol, Douglas W. Young | 2009-08-11 |
| 7503830 | Apparatus for reduction of defects in wet processed layers | Bulent M. Basol | 2009-03-17 |
| 7491308 | Method of making rolling electrical contact to wafer front surface | Homayoun Talieh, Bulent M. Basol | 2009-02-17 |
| 7476304 | Apparatus for processing surface of workpiece with small electrodes and surface contacts | Jalal Ashjaee, Boguslaw Nagorski, Bulent M. Basol, Homayoun Talieh | 2009-01-13 |
| 7456501 | Semiconductor structure having recess with conductive metal | Stephen E. Greco | 2008-11-25 |
| 7416975 | Method of forming contact layers on substrates | Bulent M. Basol, Hung-Ming Wang, Homayoun Talieh | 2008-08-26 |
| 7378004 | Pad designs and structures for a versatile materials processing apparatus | Bulent M. Basol, Homayoun Talieh | 2008-05-27 |
| 7329335 | Device providing electrical contact to the surface of a semiconductor workpiece during processing | Homayoun Talieh, Bulent M. Basol | 2008-02-12 |
| 7311811 | Device providing electrical contact to the surface of a semiconductor workpiece during processing | Homayoun Talieh, Bulent M. Basol | 2007-12-25 |
| 7309413 | Providing electrical contact to the surface of a semiconductor workpiece during processing | Homayoun Talieh, Bulent M. Basol | 2007-12-18 |
| 7309406 | Method and apparatus for plating and polishing semiconductor substrate | Homayoun Talieh | 2007-12-18 |
| 7282124 | Device providing electrical contact to the surface of a semiconductor workpiece during processing | Homayoun Talieh, Bulent M. Basol | 2007-10-16 |
| 7250104 | Method and system for optically enhanced metal planarization | Homayoun Talieh, Bulent M. Basol, Halit Yakupoglu | 2007-07-31 |
| 7244347 | Method and system to provide electrical contacts for electrotreating processes | Bulent M. Basol, Homayoun Talieh | 2007-07-17 |
| 7238092 | Low-force electrochemical mechanical processing method and apparatus | Bulent M. Basol, Jeffrey Bogart | 2007-07-03 |
| 7211174 | Method and system to provide electrical contacts for electrotreating processes | Bulent M. Basol, Homayoun Talieh, Boguslaw Nagorski, Jeffrey Bogart | 2007-05-01 |
| 7204917 | Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same | Bulent M. Basol | 2007-04-17 |
| 7201829 | Mask plate design | Bulent M. Basol, Jeff A. Bogart | 2007-04-10 |
| 7195700 | Method of electroplating copper layers with flat topography | Serdar Aksu, Bulent M. Basol | 2007-03-27 |
| 7195696 | Electrode assembly for electrochemical processing of workpiece | Bulent M. Basol | 2007-03-27 |
| 7189146 | Method for reduction of defects in wet processed layers | Bulent M. Basol | 2007-03-13 |
| 7147766 | Chip interconnect and packaging deposition methods and structures | Homayoun Talieh, Bulent M. Basol | 2006-12-12 |
| 7122473 | Edge and bevel cleaning process and system | Jalal Ashjaee, Rimma Volodarsky, Bulent M. Basol, Homayoun Talieh | 2006-10-17 |