Issued Patents All Time
Showing 301–325 of 404 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7115510 | Method for electrochemically processing a workpiece | Bulent M. Basol, Homayoun Talieh | 2006-10-03 |
| 7097755 | Electrochemical mechanical processing with advancible sweeper | Bulent M. Basol, Halit Yakupoglu, Homayoun Talieh | 2006-08-29 |
| 6979393 | Method for plating copper conductors and devices formed | Kenneth P. Rodbell, Panayotis Andricacos, Cyril Cabral, Jr., Lynne M. Gignac, Peter S. Locke | 2005-12-27 |
| 6974769 | Conductive structure fabrication process using novel layered structure and conductive structure fabricated thereby for use in multi-level metallization | Bulent M. Basol, Homayoun Talieh | 2005-12-13 |
| 6969456 | Method of using vertically configured chamber used for multiple processes | Konstantin Volodarsky, Boguslaw Nagorski, Rimma Volodarsky, Douglas W. Young, Homayoun Talieh | 2005-11-29 |
| 6946716 | Electroplated interconnection structures on integrated circuit chips | Panayotis Andricacos, Harikilia Deligianni, John O. Dukovic, Daniel C. Edelstein, Wilma Jean Horkans +4 more | 2005-09-20 |
| 6946066 | Multi step electrodeposition process for reducing defects and minimizing film thickness | Bulent M. Basol, Homayoun Talieh | 2005-09-20 |
| 6943112 | Defect-free thin and planar film processing | Bulent M. Basol | 2005-09-13 |
| 6942780 | Method and apparatus for processing a substrate with minimal edge exclusion | Bulent M. Basol, Homayoun Talieh | 2005-09-13 |
| 6936154 | Planarity detection methods and apparatus for electrochemical mechanical processing systems | Bulent M. Basol | 2005-08-30 |
| 6932896 | Method and apparatus for avoiding particle accumulation in electrodeposition | Bulent M. Basol, Homayoun Talieh | 2005-08-23 |
| 6905588 | Packaging deposition methods | Homayoun Talieh, Bulent M. Basol | 2005-06-14 |
| 6884334 | Vertically configured chamber used for multiple processes | Konstantin Volodarsky, Boguslaw A. Nigorski, Rimma Volodarsky, Douglas W. Young, Homayoun Talieh | 2005-04-26 |
| 6866763 | Method and system monitoring and controlling film thickness profile during plating and electroetching | Bulent M. Basol | 2005-03-15 |
| 6867136 | Method for electrochemically processing a workpiece | Bulent M. Basol, Homayoun Talieh | 2005-03-15 |
| 6861354 | Method and structure to reduce defects in integrated circuits and substrates | Homayoun Talieh, Bulent M. Basol | 2005-03-01 |
| 6852208 | Method and apparatus for full surface electrotreating of a wafer | Jalal Ashjaee, Boguslaw Nagorski, Bulent M. Basol, Homayoun Talieh | 2005-02-08 |
| 6852630 | Electroetching process and system | Bulent M. Basol, Halit Yakupoglu, Homayoun Talieh | 2005-02-08 |
| 6837979 | Method and apparatus for depositing and controlling the texture of a thin film | Homayoun Talieh | 2005-01-04 |
| 6821409 | Electroetching methods and systems using chemical and mechanical influence | Bulent M. Basol, Paul Lindquist, Homayoun Talieh | 2004-11-23 |
| 6815354 | Method and structure for thru-mask contact electrodeposition | Bulent M. Basol, Homayoun Talieh | 2004-11-09 |
| 6797132 | Apparatus for plating and polishing a semiconductor workpiece | Homayoun Talieh | 2004-09-28 |
| 6780772 | Method and system to provide electroplanarization of a workpiece with a conducting material layer | Bulent M. Basol, Homayoun Talieh | 2004-08-24 |
| 6777338 | Edge and bevel cleaning process and system | Jalal Ashjaee, Rimma Volodarsky, Bulent M. Basol, Homayoun Talieh | 2004-08-17 |
| 6773576 | Anode assembly for plating and planarizing a conductive layer | Rimma Volodarsky, Konstantin Volodarsky, Homayoun Talieh, Douglas W. Young | 2004-08-10 |