TL

Thomas A. Letson

IN Intel: 14 patents #2,910 of 30,777Top 10%
Overall (All Time): #347,885 of 4,157,543Top 9%
14
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
10236356 Nonplanar device with thinned lower body portion and method of fabrication Uday Shah, Brian S. Doyle, Justin K. Brask, Robert S. Chau 2019-03-19
9741809 Nonplanar device with thinned lower body portion and method of fabrication Uday Shah, Brian S. Doyle, Justin K. Brask, Robert S. Chau 2017-08-22
9190518 Nonplanar device with thinned lower body portion and method of fabrication Uday Shah, Brian S. Doyle, Justin K. Brask, Robert S. Chau 2015-11-17
8749026 Nonplanar device with thinned lower body portion and method of fabrication Uday Shah, Brian S. Doyle, Justin K. Brask, Robert S. Chau 2014-06-10
8502351 Nonplanar device with thinned lower body portion and method of fabrication Uday Shah, Brian S. Doyle, Justin K. Brask, Robert S. Chau 2013-08-06
8067818 Nonplanar device with thinned lower body portion and method of fabrication Uday Shah, Brian S. Doyle, Justin K. Brask, Robert S. Chau 2011-11-29
7821044 Transistor with improved tip profile and method of manufacture thereof Mark Bohr, Steven J. Keating, Anand S. Murthy, Donald W. O'Neill, Willy Rachmady 2010-10-26
7550333 Nonplanar device with thinned lower body portion and method of fabrication Uday Shah, Brian S. Doyle, Justin K. Brask, Robert S. Chau 2009-06-23
7494858 Transistor with improved tip profile and method of manufacture thereof Mark Bohr, Steven J. Keating, Anand S. Murthy, Donald W. O'Neill, Willy Rachmady 2009-02-24
7208399 Transistor with notched gate Charles Chu 2007-04-24
6191016 Method of patterning a layer for a gate electrode of a MOS transistor Robert S. Chau, Patricia Stokley, Peter K. Charvat, Ralph A. Schweinfurth 2001-02-20
5874358 Via hole profile and method of fabrication Alan M. Myers, Peter K. Charvat, Shi-ning Yang, Peng Bai 1999-02-23
5619071 Anchored via connection Alan M. Myers, Peter K. Charvat, Shi-ning Yang, Peng Bai 1997-04-08
5470790 Via hole profile and method of fabrication Alan M. Myers, Peter K. Charvat, Shi-ning Yang, Peng Bai 1995-11-28