Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5986315 | Guard wall to reduce delamination effects within a semiconductor die | Melton C. Bost, Robert A. Gasser, Timothy L. Deeter | 1999-11-16 |
| 5874358 | Via hole profile and method of fabrication | Alan M. Myers, Peter K. Charvat, Thomas A. Letson, Peng Bai | 1999-02-23 |
| 5619071 | Anchored via connection | Alan M. Myers, Peter K. Charvat, Thomas A. Letson, Peng Bai | 1997-04-08 |
| 5470790 | Via hole profile and method of fabrication | Alan M. Myers, Peter K. Charvat, Thomas A. Letson, Peng Bai | 1995-11-28 |
| 5270256 | Method of forming a guard wall to reduce delamination effects | Melton C. Bost, Robert A. Gasser, Timothy L. Deeter | 1993-12-14 |