Issued Patents All Time
Showing 76–82 of 82 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10121679 | Package substrate first-level-interconnect architecture | Aleksandar Aleksov, Kristof Darmawikarta, Arnab Sarkar, Hiroki Tanaka, Sri Ranga Sai Boyapati | 2018-11-06 |
| 10043740 | Package with passivated interconnects | Sri Ranga Sai Boyapati, Rahul N. Manepalli, Dilan Seneviratne, Srinivas V. Pietambaram, Kristof Darmawikarta +1 more | 2018-08-07 |
| 9953959 | Metal protected fan-out cavity | Kristof Darmawikarta, Yikang Deng, Amruthavalli Pallavi Alur, Sheng Li, Chong Zhang +2 more | 2018-04-24 |
| 9842800 | Forming interconnect structures utilizing subtractive paterning techniques | — | 2017-12-12 |
| 9820386 | Plasma etching of solder resist openings | Kristof Darmawikarta, Rahul Jain, Sheng Li, Sri Ranga Sai Boyapati | 2017-11-14 |
| 9758845 | Microelectronic substrates having copper alloy conductive route structures | Sri Ranga Sai Boyapati, Amruthavalli Pallavi Alur, Daniel N. Sobieski | 2017-09-12 |
| 9728500 | Integrated circuit surface layer with adhesion-functional group | Siddharth K. Alur, Sri Chaitra Jyotsna Chavali, Whitney Bryks | 2017-08-08 |