Issued Patents All Time
Showing 151–175 of 610 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10403556 | Semiconductor device including a heat sink structure | Johannes Georg Laven, Peter Irsigler, Joachim Mahler, Guenther Ruhl, Markus Zundel | 2019-09-03 |
| 10404250 | Transistor device | Thomas Basler, Roman Baburske, Johannes Georg Laven, Franz-Josef Niedernostheide | 2019-09-03 |
| 10396170 | Semiconductor devices and methods for forming semiconductor devices | Guenther Ruhl, Roland Rupp | 2019-08-27 |
| 10388776 | Semiconductor device having an active trench and a body trench | Maria Cotorogea, Frank Wolter, Franz-Josef Niedernostheide, Yvonne Gawlina-Schmidl | 2019-08-20 |
| 10388722 | Power semiconductor device termination structure | Elmar Falck, Josef Bauer, Jens Brandenburg | 2019-08-20 |
| 10381467 | Semiconductor device with separation regions | Roman Baburske, Matteo Dainese, Peter Lechner, Johannes Georg Laven | 2019-08-13 |
| 10367067 | Semiconductor device having an oxygen diffusion barrier | Johannes Baumgartl | 2019-07-30 |
| 10366895 | Methods for forming a semiconductor device using tilted reactive ion beam | Johannes Georg Laven, Anton Mauder, Werner Schustereder | 2019-07-30 |
| 10355116 | Power semiconductor device | Markus Bina, Thomas Basler, Matteo Dainese | 2019-07-16 |
| 10347723 | Method of manufacturing a semiconductor device having graphene material | Guenther Ruhl, Gunther Lippert, Thomas Zimmer | 2019-07-09 |
| 10340335 | Method of forming a semiconductor device | Reinhard Ploss | 2019-07-02 |
| 10340264 | Semiconductor device comprising a clamping structure | Stephan Voss, Roman Baburske, Thomas Basler, Thomas Kimmer | 2019-07-02 |
| 10337117 | Method of manufacturing a silicon ingot and silicon ingot | Nico Caspary | 2019-07-02 |
| 10332973 | N-channel bipolar power semiconductor device with p-layer in the drift volume | Roman Baburske, Markus Bina, Oana Julia Spulber | 2019-06-25 |
| 10325996 | Method for producing a doped semiconductor layer | Franz Hirler, Anton Mauder, Helmut Strack, Frank Kahlmann, Gerhard Miller | 2019-06-18 |
| 10325809 | Methods for splitting semiconductor devices and semiconductor device | Martin FACCINELLI, Johannes Georg Laven | 2019-06-18 |
| 10325804 | Method of wafer thinning and realizing backside metal structures | Oliver Hellmund, Johannes Baumgartl, Iris Moder, Ingo Muri, Thomas Neidhart | 2019-06-18 |
| 10319599 | Methods of planarizing SiC surfaces | Helmut Oefner, Roland Rupp | 2019-06-11 |
| 10317338 | Method and assembly for determining the carbon content in silicon | Naveen Goud Ganagona, Moriz Jelinek, Helmut Oefner, Werner Schustereder | 2019-06-11 |
| 10312258 | Semiconductor device with buried cavities and dielectric support structures | Johannes Georg Laven, Matteo Dainese | 2019-06-04 |
| 10276656 | Method of manufacturing semiconductor devices by using epitaxy and semiconductor devices with a lateral structure | Frank Hille, Andre Brockmeier, Francisco Javier Santos Rodriguez, Daniel Schloegl | 2019-04-30 |
| 10273597 | Method of manufacturing CZ silicon wafers, and method of manufacturing a semiconductor device | Johannes Freund, Thomas Wuebben, Helmut Oefner | 2019-04-30 |
| 10269896 | Semiconductor wafer and method of manufacturing semiconductor devices in a semiconductor wafer | Hans Weber, Wolfgang Jantscher | 2019-04-23 |
| 10263101 | Semiconductor device with deep diffusion region | Thomas Wuebben, Peter Irsigler | 2019-04-16 |
| 10249746 | Bipolar transistor with superjunction structure | Frank Pfirsch, Franz-Josef Niedernostheide, Stephan Voss | 2019-04-02 |