Issued Patents All Time
Showing 26–44 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8089157 | Contact metallurgy structure | Cyril Cabral, Jr., Hariklia Deligianni, Randolph F. Knarr, Sandra G. Malhotra, Stephen M. Rossnagel +2 more | 2012-01-03 |
| 7964479 | Low-temperature formation of layers of polycrystalline semiconductor material | Francesca Iacopi | 2011-06-21 |
| 7947162 | Free standing single-crystal nanowire growth by electro-chemical deposition | Geoffroy Hautier | 2011-05-24 |
| 7897494 | Formation of single crystal semiconductor nanowires | — | 2011-03-01 |
| 7868410 | Gate stack engineering by electrochemical processing utilizing through-gate-dielectric current flow | Veeraraghavan S. Basker, Cyril Cabral, Jr., Emanuel I. Cooper, Hariklia Deligianni, Martin M. Frank +4 more | 2011-01-11 |
| 7851357 | Method of forming electrodeposited contacts | Cyril Cabral, Jr., Lili Deligianni, Randolph F. Knarr, Sandra G. Malhotra, Stephen M. Rossnagel +2 more | 2010-12-14 |
| 7825516 | Formation of aligned capped metal lines and interconnections in multilevel semiconductor structures | Stefanie Chiras, Michael Lane, Sandra G. Malhotra, Fenton R. Mc Feely, Robert Rosenberg +1 more | 2010-11-02 |
| 7736474 | Plating apparatus and plating method | Keiichi Kurashina, Mizuki Nagai, Satoru Yamamoto, Hiroyuki Kanda, Koji Mishima +7 more | 2010-06-15 |
| 7718531 | Method for forming catalyst nanoparticles for growing elongated nanostructures | Aleksandar Radisic | 2010-05-18 |
| 7678258 | Void-free damascene copper deposition process and means of monitoring thereof | Panayotis Andricacos, Dean S. Chung, Hariklia Deligianni, James E. Fluegel, Keith Kwietniak +4 more | 2010-03-16 |
| 7446040 | Structure for optimizing fill in semiconductor features deposited by electroplating | Conal E. Murray | 2008-11-04 |
| 7405154 | Structure and method of forming electrodeposited contacts | Cyril Cabral, Jr., Hariklia Deligianni, Randolph F. Knarr, Sandra G. Malhotra, Stephen M. Rossnagel +2 more | 2008-07-29 |
| 7368045 | Gate stack engineering by electrochemical processing utilizing through-gate-dielectric current flow | Veeraraghavan S. Basker, Cyril Cabral, Jr., Emanuel I. Cooper, Hariklia Deligianni, Martin M. Frank +4 more | 2008-05-06 |
| 7190079 | Selective capping of copper wiring | Panayotis Andricacos, Shyng-Tsong Chen, John M. Cotte, Hariklia Deligianni, Mahadevaiyer Krishnan +1 more | 2007-03-13 |
| 7112851 | Field effect transistor with electroplated metal gate | Panayotis Andricacos, Cyril Cabral, Jr., Hariklia Deligianni, Emanuel I. Cooper, Katherine L. Saenger | 2006-09-26 |
| 7008871 | Selective capping of copper wiring | Panayotis Andricacos, Shyng-Tsong Chen, John M. Cotte, Hariklia Deligianni, Mahadevaiyer Krishnan +1 more | 2006-03-07 |
| 6974531 | Method for electroplating on resistive substrates | Panayotis Andricacos, Hariklia Deligianni, Wilma Jean Horkans, Keith Kwietniak, Michael Lane +4 more | 2005-12-13 |
| 6967131 | Field effect transistor with electroplated metal gate | Katherine L. Saenger, Cyril Cabral, Jr., Emanuel I. Cooper, Hariklia Deligianni, Panayotis Andricacos | 2005-11-22 |
| 6309969 | Copper metallization structure and method of construction | Gerko Oskam, Peter C. Searson, John G. Long, Peter Hoffmann | 2001-10-30 |