Issued Patents All Time
Showing 51–65 of 65 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6451712 | Method for forming a porous dielectric material layer in a semiconductor device and device formed | Timothy J. Dalton, Jeffrey Hedrick, Satyanarayana V. Nitta, Sampath Purushothaman, Kenneth P. Rodbell +1 more | 2002-09-17 |
| 6348736 | In situ formation of protective layer on silsesquioxane dielectric for dual damascene process | Vincent J. McGahay, John P. Hummel, Joyce C. Liu, Rebecca D. Mih, Kamalesh K. Srivastava +1 more | 2002-02-19 |
| 6339022 | Method of annealing copper metallurgy | Arne Ballantine, Edward C. Cooney, III, George A. Dunbar, III, Cheryl G. Faltermeier, Jeffrey D. Gilbert +9 more | 2002-01-15 |
| 6329280 | Interim oxidation of silsesquioxane dielectric for dual damascene process | Robert Cook, John P. Hummel, Joyce C. Liu, Vincent J. McGahay, Rebecca D. Mih +1 more | 2001-12-11 |
| 6221780 | Dual damascene flowable oxide insulation structure and metallic barrier | John P. Hummel, Joyce C. Liu, Vincent J. McGahay, Rebecca D. Mih, Kamalesh K. Srivastava | 2001-04-24 |
| 6174814 | Method for producing a crack stop for interlevel dielectric layers | Robert Cook, Eduardo Garcia, Nancy Anne Greco, Ernest N. Levine | 2001-01-16 |
| 6140234 | Method to selectively fill recesses with conductive metal | Cyprian Emeka Uzoh | 2000-10-31 |
| 6121129 | Method of contact structure formation | Nancy Anne Greco, Tina Wagner | 2000-09-19 |
| 6091131 | Integrated circuit having crack stop for interlevel dielectric layers | Robert Cook, Eduardo Garcia, Nancy Anne Greco, Ernest N. Levine | 2000-07-18 |
| 5928960 | Process for reducing pattern factor effects in CMP planarization | Nancy Anne Greco | 1999-07-27 |
| 5530290 | Large scale IC personalization method employing air dielectric structure for extended conductor | John M. Aitken, Klaus D. Beyer, Billy L. Crowder | 1996-06-25 |
| 5444015 | Larce scale IC personalization method employing air dielectric structure for extended conductors | John M. Aitken, Klaus D. Beyer, Billy L. Crowder | 1995-08-22 |
| 5371047 | Chip interconnection having a breathable etch stop layer | Kris V. Srikrishnan | 1994-12-06 |
| 4997746 | Method of forming conductive lines and studs | Nancy Anne Greco | 1991-03-05 |
| 4600683 | Cross-linked polyalkenyl phenol based photoresist compositions | Dennis C. Green | 1986-07-15 |