Issued Patents All Time
Showing 76–100 of 116 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8286855 | Method of full-field solder coverage by inverting a fill head and a mold | John P. Karidis, Mark D. Schultz | 2012-10-16 |
| 8181846 | Method of full-field solder coverage using a vacuum fill head | John P. Karidis, Mark D. Schultz | 2012-05-22 |
| 8123089 | Dispensing assembly with an injector controlled gas environment | Glen N. Biggs, Benjamin V. Fasano, John J. Garant, G. Gerard Gormley, John P. Karidis +2 more | 2012-02-28 |
| 8123088 | Dispensing assembly with a controlled gas environment | Glen N. Biggs, Benjamin V. Fasano, John J. Garant, John P. Karidis, Christopher L. Tessler +1 more | 2012-02-28 |
| 8111730 | 3D optoelectronic packaging | Paul F. Fortier, Frank R. Libsch | 2012-02-07 |
| 8087566 | Techniques for arranging solder balls and forming bumps | Frank R. Libsch, Jae-Woong Nah | 2012-01-03 |
| 8011563 | Compliant mold fill head with integrated cavity venting and solder cooling | Evan G. Colgan, Peter A. Gruber, Gareth G. Hougham, John P. Karidis | 2011-09-06 |
| 7980445 | Fill head for full-field solder coverage with a rotatable member | John P. Karidis, Mark D. Schultz | 2011-07-19 |
| 7891538 | Techniques for arranging solder balls and forming bumps | Frank R. Libsch, Jae-Woong Nah | 2011-02-22 |
| 7883277 | Interconnecting (mapping) a two-dimensional optoelectronic (OE) device array to a one-dimensional waveguide array | Punit P. Chiniwalla, John Andrew Guckenberger, Jeffrey A. Kash, Jeremy D. Schaub, Michael R. T. Tan +2 more | 2011-02-08 |
| 7853105 | Coupling element alignment using waveguide fiducials | Punit P. Chiniwalla, Philip C. D. Hobbs, Frank R. Libsch | 2010-12-14 |
| 7780063 | Techniques for arranging solder balls and forming bumps | Frank R. Libsch, Jae-Woong Nah | 2010-08-24 |
| 7613368 | Mixed electrical and optical LGA interposer for facilitating chip to board communications by dual signal types | Gareth G. Hougham, Punit P. Chiniwalla, Paul W. Coteus, Alphonso P. Lanzetta, Frank R. Libsch | 2009-11-03 |
| 7542643 | Coupling element alignment using waveguide fiducials | Punit P. Chiniwalla, Philip C. D. Hobbs, Frank R. Libsch | 2009-06-02 |
| 7474815 | Interconnecting (mapping) a two-dimensional optoelectronic (OE) device array to a one-dimensional waveguide array | Punit P. Chiniwalla, John Andrew Guckenberger, Jeffrey A. Kash, Jeremy D. Schaub, Michael R. T. Tan +2 more | 2009-01-06 |
| 7456046 | Method to create flexible connections for integrated circuits | Leena Paivikki Buchwalter, Chirag S. Patel | 2008-11-25 |
| 7421160 | Coupling element alignment using waveguide fiducials | Punit P. Chiniwalla, Philip C. D. Hobbs, Frank R. Libsch | 2008-09-02 |
| 7404251 | Manufacture of printed circuit boards with stubless plated through-holes | Stephen L. Buchwalter | 2008-07-29 |
| 7367715 | Medium containing optical paths and electrically conducting paths for applications in high speed data links | Punit P. Chiniwalla, Derek B. Dove, James L. Sanford | 2008-05-06 |
| 7352066 | Silicon based optical vias | Punit P. Chiniwalla, Chirag S. Patel | 2008-04-01 |
| 7308167 | Optical assembly with optoelectronic device alignment | Gary R. Trott, Jeannine M. Trewhella | 2007-12-11 |
| 7212698 | Circuit board integrated optical coupling elements | Urs Bapst, Christoph Berger, Folkert Horst, Bert Jan Offrein | 2007-05-01 |
| 7019402 | Silicon chip carrier with through-vias using laser assisted chemical vapor deposition of conductor | Paul S. Andry, Leena Paivikki Buchwalter, Thomas A. Wassick | 2006-03-28 |
| 6803972 | Polarization conversion system | Derek B. Dove, Rama N. Singh | 2004-10-12 |
| 6747611 | Compact optical system and packaging for head mounted display | Derek B. Dove, Istvan Lovas, Robert S. Olyha, Jr., Carl G. Powell | 2004-06-08 |