PH

Pouya Hashemi

IBM: 550 patents #15 of 70,183Top 1%
Globalfoundries: 25 patents #110 of 4,424Top 3%
ET Elpis Technologies: 3 patents #8 of 121Top 7%
Samsung: 2 patents #37,631 of 75,807Top 50%
TE Tessera: 1 patents #207 of 271Top 80%
📍 Purchase, NY: #1 of 53 inventorsTop 2%
🗺 New York: #17 of 115,490 inventorsTop 1%
Overall (All Time): #268 of 4,157,543Top 1%
581
Patents All Time

Issued Patents All Time

Showing 476–500 of 581 patents

Patent #TitleCo-InventorsDate
9508851 Formation of bulk SiGe fin with dielectric isolation by anodization Thomas N. Adam, Kangguo Cheng, Bruce B. Doris, Ali Khakifirooz, Alexander Reznicek 2016-11-29
9502243 Multi-orientation SOI substrates for co-integration of different conductivity type semiconductor devices Kangguo Cheng, Bruce B. Doris, Ali Khakifirooz, Alexander Reznicek 2016-11-22
9502245 Elimination of defects in long aspect ratio trapping trench structures Kangguo Cheng, Ali Khakifirooz, Alexander Reznicek 2016-11-22
9496260 Tall strained high percentage silicon germanium fins for CMOS Karthik Balakrishnan, Kangguo Cheng, Alexander Reznicek 2016-11-15
9496401 III-V device structure with multiple threshold voltage Kangguo Cheng, Keith E. Fogel, Alexander Reznicek 2016-11-15
9496400 FinFET with stacked faceted S/D epitaxy for improved contact resistance Karthik Balakrishnan, Kangguo Cheng, Alexander Reznicek 2016-11-15
9496373 Damage-resistant fin structures and FinFET CMOS Kangguo Cheng, Ali Khakifirooz, Alexander Reznicek 2016-11-15
9496263 Stacked strained and strain-relaxed hexagonal nanowires Takashi Ando, John A. Ott, Alexander Reznicek 2016-11-15
9490332 Atomic layer doping and spacer engineering for reduced external resistance in finFETs Karthik Balakrishnan, Kevin K. Chan 2016-11-08
9490161 Channel SiGe devices with multiple threshold voltages on hybrid oriented substrates, and methods of manufacturing same Bruce B. Doris, Lisa F. Edge, Alexander Reznicek 2016-11-08
9484405 Stacked nanowire devices formed using lateral aspect ratio trapping Karthik Balakrishnan, Kangguo Cheng, Alexander Reznicek 2016-11-01
9484412 Strained silicon—germanium integrated circuit with inversion capacitance enhancement and method to fabricate same Takashi Ando, Pranita Kerber, Alexander Reznicek 2016-11-01
9483592 Maintaining stress in a layout design of an integrated circuit having fin-type field-effect transistor devices Karthik Balakrishnan, Jeffrey W. Sleight, Tenko Yamashita 2016-11-01
9484266 Complementary heterogeneous MOSFET using global SiGe substrate and hard-mask memorized germanium dilution for nFET Karthik Balakrishnan, Kangguo Cheng, Alexander Reznicek 2016-11-01
9478642 Semiconductor junction formation Shogo Mochizuki, Alexander Reznicek, Dominic J. Schepis 2016-10-25
9472628 Heterogeneous source drain region and extension region Kangguo Cheng, Ali Khakifirooz, Alexander Reznicek 2016-10-18
9472671 Method and structure for forming dually strained silicon Karthik Balakrishnan, Kangguo Cheng, Alexander Reznicek 2016-10-18
9472460 Uniform depth fin trench formation Alexander Reznicek, Kangguo Cheng, Ali Khakifirooz, Dominic J. Schepis 2016-10-18
9472471 Hybrid orientation vertically stacked III-V and Ge gate-all-around CMOS Karthik Balakrishnan, Sanghoon Lee, Alexander Reznicek 2016-10-18
9472555 Nanosheet CMOS with hybrid orientation Karthik Balakrishnan, Kangguo Cheng, Alexander Reznicek 2016-10-18
9472575 Formation of strained fins in a finFET device Ali Khakifirooz, Alexander Reznicek 2016-10-18
9472573 Silicon-germanium fin formation Kangguo Cheng, Ali Khakifirooz, Alexander Reznicek 2016-10-18
9466567 Nanowire compatible E-fuse Kangguo Cheng, Bruce B. Doris, Ali Khakifirooz, Alexander Reznicek 2016-10-11
9466672 Reduced defect densities in graded buffer layers by tensile strained interlayers Kangguo Cheng, Keith E. Fogel, John A. Ott, Alexander Reznicek 2016-10-11
9466690 Precisely controlling III-V height Karthik Balakrishnan, Kangguo Cheng, Alexander Reznicek 2016-10-11