Issued Patents All Time
Showing 126–140 of 140 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9793213 | Ion flow barrier structure for interconnect metallization | James J. Demarest, James J. Kelly, Koichi Motoyama, Christopher J. Penny | 2017-10-17 |
| 9786596 | Fuse formed from III-V aspect ratio structure | Praneet Adusumilli, Alexander Reznicek, Chih-Chao Yang | 2017-10-10 |
| 9786595 | Antifuse having comb-like top electrode | Praneet Adusumilli, Alexander Reznicek, Chih-Chao Yang | 2017-10-10 |
| 9741812 | Dual metal interconnect structure | Praneet Adusumilli, Hemanth Jagannathan, Koichi Motoyama | 2017-08-22 |
| 9735165 | Vertically stacked FinFET fuse | Praneet Adusumilli, Alexander Reznicek | 2017-08-15 |
| 9722038 | Metal cap protection layer for gate and contact metallization | Praneet Adusumilli, Hemanth Jagannathan, Alexander Reznicek, Chih-Chao Yang | 2017-08-01 |
| 9613899 | Epitaxial semiconductor fuse for FinFET structure | Praneet Adusumilli, Alexander Reznicek, Chih-Chao Yang | 2017-04-04 |
| 9564310 | Metal-insulator-metal capacitor fabrication with unitary sputtering process | Praneet Adusumilli, Alexander Reznicek, Chih-Chao Yang | 2017-02-07 |
| 9437714 | Selective gate contact fill metallization | Praneet Adusumilli, Alexander Reznicek, Chih-Chao Yang | 2016-09-06 |
| 8835326 | Titanium-nitride removal | John A. Fitzsimmons, Shyng-Tsong Chen, David L. Rath, Muthumanickam Sankarapandian | 2014-09-16 |
| 8664766 | Interconnect structure containing non-damaged dielectric and a via gouging feature | Chih-Chao Yang, Terry A. Spooner | 2014-03-04 |
| 7960274 | Structure and method for creating reliable via contacts for interconnect applications | Chih-Chao Yang | 2011-06-14 |
| 7800228 | Reliable via contact interconnect structure | Chih-Chao Yang | 2010-09-21 |
| 7528066 | Structure and method for metal integration | Chih-Chao Yang, Terry A. Spooner | 2009-05-05 |
| 7405153 | Method for direct electroplating of copper onto a non-copper plateable layer | Sandra G. Malhotra, Hariklia Deligianni, Stephen M. Rossnagel, Xiaoyan Shao, Tsong-Lin Tai | 2008-07-29 |