Issued Patents All Time
Showing 101–125 of 140 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10037942 | Low resistance contact structures for trench structures | Praneet Adusumilli, Alexander Reznicek, Chih-Chao Yang | 2018-07-31 |
| 10038050 | FinFET resistor and method to fabricate same | Praneet Adusumilli, Keith E. Fogel, Alexander Reznicek | 2018-07-31 |
| 10032721 | Low resistance contact structures for trench structures | Praneet Adusumilli, Alexander Reznicek, Chih-Chao Yang | 2018-07-24 |
| 10008507 | Metal FinFET anti-fuse | Praneet Adusumilli, Alexander Reznicek, Miaomiao Wang, Chih-Chao Yang | 2018-06-26 |
| 10008563 | Dielectric with air gaps for use in semiconductor devices | Praneet Adusumilli, Alexander Reznicek, Chih-Chao Yang | 2018-06-26 |
| 10002789 | High performance middle of line interconnects | Praneet Adusumilli, Alexander Reznicek, Chih-Chao Yang | 2018-06-19 |
| 9997453 | Antifuse having comb-like top electrode | Praneet Adusumilli, Alexander Reznicek, Chih-Chao Yang | 2018-06-12 |
| 9997590 | FinFET resistor and method to fabricate same | Praneet Adusumilli, Keith E. Fogel, Alexander Reznicek | 2018-06-12 |
| 9966305 | Ion flow barrier structure for interconnect metallization | James J. Demarest, James J. Kelly, Koichi Motoyama, Christopher J. Penny | 2018-05-08 |
| 9960240 | Low resistance contact structures for trench structures | Praneet Adusumilli, Alexander Reznicek, Chih-Chao Yang | 2018-05-01 |
| 9954050 | Precise/designable FinFET resistor structure | Praneet Adusumilli, Shanti Pancharatnam, Alexander Reznicek | 2018-04-24 |
| 9947621 | Structure and method to reduce copper loss during metal cap formation | Praneet Adusumilli, Alexander Reznicek | 2018-04-17 |
| 9941204 | III-V compatible anti-fuses | Praneet Adusumilli, Alexander Reznicek, Chih-Chao Yang | 2018-04-10 |
| 9934977 | Salicide bottom contacts | Praneet Adusumilli, Alexander Reznicek | 2018-04-03 |
| 9935051 | Multi-level metallization interconnect structure | Praneet Adusumilli, Alexander Reznicek | 2018-04-03 |
| 9922941 | Thin low defect relaxed silicon germanium layers on bulk silicon substrates | Praneet Adusumilli, Keith E. Fogel, Alexander Reznicek | 2018-03-20 |
| 9881798 | Metal cap integration by local alloying | Praneet Adusumilli, Alexander Reznicek, Chih-Chao Yang | 2018-01-30 |
| 9876075 | Method of forming dielectric with air gaps for use in semiconductor devices | Praneet Adusumilli, Alexander Reznicek, Chih-Chao Yang | 2018-01-23 |
| 9865538 | Metallic blocking layer for reliable interconnects and contacts | Praneet Adusumilli, Alexander Reznicek, Chih-Chao Yang | 2018-01-09 |
| 9859219 | Copper wiring structures with copper titanium encapsulation | Praneet Adusumilli, Alexander Reznicek | 2018-01-02 |
| 9852981 | III-V compatible anti-fuses | Praneet Adusumilli, Alexander Reznicek, Chih-Chao Yang | 2017-12-26 |
| 9842770 | Reflow enhancement layer for metallization structures | Praneet Adusumilli, Alexander Reznicek | 2017-12-12 |
| 9831254 | Multiple breakdown point low resistance anti-fuse structure | Praneet Adusumilli, Adra Carr, Alexander Reznicek | 2017-11-28 |
| 9824967 | Semiconductor resistor structures embedded in a middle-of-the-line (MOL) dielectric | Praneet Adusumilli, Alexander Reznicek, Chih-Chao Yang | 2017-11-21 |
| 9812522 | Metal-insulator-metal capacitor fabrication with unitary sputtering process | Praneet Adusumilli, Alexander Reznicek, Chih-Chao Yang | 2017-11-07 |