Issued Patents All Time
Showing 76–100 of 140 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10355094 | Low resistance contact structures for trench structures | Praneet Adusumilli, Alexander Reznicek, Chih-Chao Yang | 2019-07-16 |
| 10340355 | Method of forming a dual metal interconnect structure | Praneet Adusumilli, Hemanth Jagannathan, Koichi Motoyama | 2019-07-02 |
| 10340221 | Stacked FinFET anti-fuse | Alexander Reznicek, Praneet Adusumilli, Keith E. Fogel | 2019-07-02 |
| 10312097 | Salicide bottom contacts | Praneet Adusumilli, Alexander Reznicek | 2019-06-04 |
| 10304773 | Low resistance contact structures including a copper fill for trench structures | Praneet Adusumilli, Alexander Reznicek, Chih-Chao Yang | 2019-05-28 |
| 10304841 | Metal FinFET anti-fuse | Praneet Adusumilli, Alexander Reznicek, Miaomiao Wang, Chih-Chao Yang | 2019-05-28 |
| 10269710 | Multi-level metallization interconnect structure | Praneet Adusumilli, Alexander Reznicek | 2019-04-23 |
| 10269698 | Binary metallization structure for nanoscale dual damascene interconnects | Alexander Reznicek, Praneet Adusumilli, Koichi Motoyama | 2019-04-23 |
| 10249501 | Single process for liner and metal fill | Praneet Adusumilli, Alexander Reznicek, Chih-Chao Yang | 2019-04-02 |
| 10249724 | Low resistance contact structures for trench structures | Praneet Adusumilli, Alexander Reznicek, Chih-Chao Yang | 2019-04-02 |
| 10224281 | Metallic blocking layer for reliable interconnects and contacts | Praneet Adusumilli, Alexander Reznicek, Chih-Chao Yang | 2019-03-05 |
| 10211095 | High performance middle of line interconnects | Praneet Adusumilli, Alexander Reznicek, Chih-Chao Yang | 2019-02-19 |
| 10170423 | Metal cap integration by local alloying | Praneet Adusumilli, Alexander Reznicek, Chih-Chao Yang | 2019-01-01 |
| 10170360 | Reflow enhancement layer for metallization structures | Praneet Adusumilli, Alexander Reznicek | 2019-01-01 |
| 10170419 | Biconvex low resistance metal wire | Praneet Adusumilli, Alexander Reznicek | 2019-01-01 |
| 10128188 | High aspect ratio contact metallization without seams | Praneet Adusumilli, Alexander Reznicek, Chih-Chao Yang | 2018-11-13 |
| 10128151 | Devices and methods of cobalt fill metallization | Vimal Kamineni, James J. Kelly, Praneet Adusumilli, Balasubramanian Pranatharthiharan | 2018-11-13 |
| 10115665 | Semiconductor resistor structures embedded in a middle-of-the-line (MOL) dielectric | Praneet Adusumilli, Alexander Reznicek, Chih-Chao Yang | 2018-10-30 |
| 10109740 | Programmable bulk FinFET antifuses | Praneet Adusumilli, Alexander Reznicek | 2018-10-23 |
| 10090287 | Deep high capacity capacitor for bulk substrates | Praneet Adusumilli, Keith E. Fogel, Alexander Reznicek | 2018-10-02 |
| 10090151 | Structure and method to reduce copper loss during metal cap formation | Praneet Adusumilli, Alexander Reznicek | 2018-10-02 |
| 10074727 | Low resistivity wrap-around contacts | Praneet Adusumilli, Adra Carr, Alexander Reznicek | 2018-09-11 |
| 10056391 | Vertically stacked FinFET fuse | Praneet Adusumilli, Alexander Reznicek | 2018-08-21 |
| 10056329 | Programmable buried antifuse | Praneet Adusumilli, Keith E. Fogel, Alexander Reznicek | 2018-08-21 |
| 10049980 | Low resistance seed enhancement spacers for voidless interconnect structures | Praneet Adusumilli, Joseph F. Maniscalco, Alexander Reznicek | 2018-08-14 |