Issued Patents All Time
Showing 26–50 of 140 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11557482 | Electrode with alloy interface | Chih-Chao Yang, Daniel C. Edelstein, Chao-Kun Hu | 2023-01-17 |
| 11430690 | Interconnects having air gap spacers | Kenneth Chun Kuen Cheng, Koichi Motoyama, Joseph F. Maniscalco, Chih-Chao Yang | 2022-08-30 |
| 11380641 | Pillar bump with noble metal seed layer for advanced heterogeneous integration | Joseph F. Maniscalco, Kenneth Chun Kuen Cheng, Koichi Motoyama, Alexander Reznicek | 2022-07-05 |
| 11322359 | Single process for liner and metal fill | Praneet Adusumilli, Alexander Reznicek, Chih-Chao Yang | 2022-05-03 |
| 11270910 | Interconnect structure with partial sidewall liner | Alexander Reznicek | 2022-03-08 |
| 11239414 | Physical unclonable function for MRAM structures | Ruilong Xie, Alexander Reznicek, Koichi Motoyama | 2022-02-01 |
| 11183455 | Interconnects with enlarged contact area | Koichi Motoyama, Kenneth Chun Kuen Cheng, Joseph F. Maniscalco | 2021-11-23 |
| 11177171 | Encapsulated top via interconnects | Kenneth Chun Kuen Cheng, Joseph F. Maniscalco, Koichi Motoyama | 2021-11-16 |
| 11158538 | Interconnect structures with cobalt-infused ruthenium liner and a cobalt cap | Joseph F. Maniscalco, Koichi Motoyama, Scott A. DeVries, Alexander Reznicek | 2021-10-26 |
| 11081542 | Buried MIM capacitor structure with landing pads | Alexander Reznicek, Praneet Adusumilli, Joshua M. Rubin | 2021-08-03 |
| 11081543 | Multi-spheroid BEOL capacitor | Alexander Reznicek, Praneet Adusumilli, Shanti Pancharatnam | 2021-08-03 |
| 11069566 | Hybrid sidewall barrier facilitating low resistance interconnection | Koichi Motoyama, Joseph F. Maniscalco, Scott A. DeVries | 2021-07-20 |
| 11069854 | Laser anneal for MRAM encapsulation enhancement | Michael Rizzolo, Alexander Reznicek, Oleg Gluschenkov | 2021-07-20 |
| 11038097 | Magnetic structures with tapered edges | Bruce B. Doris, Alexander Reznicek, Praneet Adusumilli | 2021-06-15 |
| 11011697 | Faceted sidewall magnetic tunnel junction structure | Alexander Reznicek, Praneet Adusumilli | 2021-05-18 |
| 11004735 | Conductive interconnect having a semi-liner and no top surface recess | Cornelius Brown Peethala, Michael Rizzolo, Chih-Chao Yang | 2021-05-11 |
| 10950493 | Interconnects having air gap spacers | Kenneth Chun Kuen Cheng, Koichi Motoyama, Joseph F. Maniscalco, Chih-Chao Yang | 2021-03-16 |
| 10892346 | Bipolar junction transistor (BJT) for liquid flow biosensing applications without a reference electrode and large sensing area | Alexander Reznicek, Tak H. Ning, Sufi Zafar | 2021-01-12 |
| 10840325 | Low resistance metal-insulator-metal capacitor electrode | Joseph F. Maniscalco, Koichi Motoyama, Chih-Chao Yang | 2020-11-17 |
| 10796911 | Hardmask stress, grain, and structure engineering for advanced memory applications | Michael Rizzolo, Ashim Dutta, Chih-Chao Yang | 2020-10-06 |
| 10784194 | BEOL embedded high density vertical resistor structure | Alexander Reznicek, Praneet Adusumilli | 2020-09-22 |
| 10756163 | Conformal capacitor structure formed by a single process | Praneet Adusumilli, Alexander Reznicek | 2020-08-25 |
| 10741609 | Pre-patterned etch stop for interconnect trench formation overlying embedded MRAM structures | Gangadhara Raja Muthinti, Michael Rizzolo, Chih-Chao Yang | 2020-08-11 |
| 10741492 | FinFET fuses formed at tight pitch dimensions | Alexander Reznicek, Praneet Adusumilli, Bahman Hekmatshoartabari | 2020-08-11 |
| 10734575 | ReRAM structure formed by a single process | Alexander Reznicek, Adra Carr, Praneet Adusumilli | 2020-08-04 |