MY

Min Yang

IBM: 71 patents #1,021 of 70,183Top 2%
MC Macronix International Co.: 8 patents #224 of 1,241Top 20%
Globalfoundries: 5 patents #673 of 4,424Top 20%
QA Qimonda Ag: 5 patents #52 of 575Top 10%
📍 Yorktown Heights, NY: #38 of 858 inventorsTop 5%
🗺 New York: #936 of 115,490 inventorsTop 1%
Overall (All Time): #25,109 of 4,157,543Top 1%
76
Patents All Time

Issued Patents All Time

Showing 26–50 of 76 patents

Patent #TitleCo-InventorsDate
8273598 Method for forming a self-aligned bit line for PCRAM and self-aligned etch back process Matthew J. Breitwisch, Chieh-Fang Chen, Shih-Hung Chen, Eric A. Joseph, Chung H. Lam +3 more 2012-09-25
8097516 Dual trench isolation for CMOS with hybrid orientations Victor Chan, Meikei Ieong, Rajesh Rengarajan, Alexander Reznicek, Chun-Yung Sung 2012-01-17
8030634 Memory array with diode driver and method for fabricating the same Hsiang-Lan Lung, Thomas Happ, Bipin Rajendran 2011-10-04
7955958 Method for fabrication of polycrystalline diodes for resistive memories Bipin Rajendran, Thomas Happ, Hsiang-Lan Lung 2011-06-07
7943486 Enhancement of electron and hole mobilities in <110> Si under biaxial compressive strain Victor Chan, Massimo V. Fischetti, John Michael Hergenrother, Meikei Ieong, Rajesh Rengarajan +3 more 2011-05-17
7915100 Hybrid orientation CMOS with partial insulation process 2011-03-29
7833854 Structure and method of fabricating a hybrid substrate for high-performance hybrid-orientation silicon-on-insulator CMOS devices Meikei Ieong 2010-11-16
7834425 Hybrid orientation SOI substrates, and method for forming the same Meikei Ieong, Xinlin Wang 2010-11-16
7791057 Memory cell having a buried phase change region and method for fabricating the same Hsiang-Lan Lung, Chung H. Lam, Alejandro G. Schrott 2010-09-07
7713807 High-performance CMOS SOI devices on hybrid crystal-oriented substrates Bruce B. Doris, Kathryn Guarini, Meikei Ieong, Shreesh Narasimha, Kern Rim +1 more 2010-05-11
7691482 Structure for planar SOI substrate with multiple orientations Huilong Zhu, Bruce B. Doris, Meikei Ieong, Philip J. Oldiges 2010-04-06
7691688 Strained silicon CMOS on hybrid crystal orientations Kevin K. Chan, Meikei Ieong, Alexander Reznicek, Devendra K. Sadana, Leathen Shi 2010-04-06
7629233 Hybrid crystal orientation CMOS structure for adaptive well biasing and for power and performance enhancement Kerry Bernstein, Jeffery Sleight 2009-12-08
7605429 Hybrid crystal orientation CMOS structure for adaptive well biasing and for power and performance enhancement Kerry Bernstein, Jeffrey W. Sleight 2009-10-20
7485506 Hybrid substrate technology for high-mobility planar and multiple-gate MOSFETS Bruce B. Doris, Meikei Ieong, Edward J. Nowak 2009-02-03
7482216 Substrate engineering for optimum CMOS device performance Victor Chan, Meikei Ieong 2009-01-27
7465992 Field effect transistor with mixed-crystal-orientation channel and source/drain regions Joel P. Desouza, Devendra K. Sadana, Katherine L. Saenger, Chun-Yung Sung, Haizhou Yin 2008-12-16
7462525 Enhancement of electron and hole mobilities in <110> Si under biaxial compressive strain Victor Chan, Massimo V. Fischetti, John Michael Hergenrother, Meikei Ieong, Rajesh Rengarajan +3 more 2008-12-09
7459752 Ultra thin body fully-depleted SOI MOSFETs Bruce B. Doris, Meikei Ieong, Zhibin Ren, Paul M. Solomon 2008-12-02
7449767 Mixed orientation and mixed material semiconductor-on-insulator wafer Guy M. Cohen, Alexander Reznicek, Katherine L. Saenger 2008-11-11
7439542 Hybrid orientation CMOS with partial insulation process 2008-10-21
7425483 Structure and method of fabricating a hybrid substrate for high-performance hybrid-orientation silicon-on-insulator CMOS devices Meikei Ieong 2008-09-16
7402466 Strained silicon CMOS on hybrid crystal orientations Kevin K. Chan, Meikei Ieong, Alexander Reznicek, Devendra K. Sadana, Leathen Shi 2008-07-22
7385257 Hybrid orientation SOI substrates, and method for forming the same Meikei Ieong, Xinlin Wang 2008-06-10
7364958 CMOS on hybrid substrate with different crystal orientations using silicon-to-silicon direct wafer bonding Meikei Ieong, Alexander Reznicek 2008-04-29