Issued Patents All Time
Showing 101–122 of 122 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7115996 | Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped | Daniel C. Edelstein, Sung Kwon Kang, Maurice McGlashan-Powell, George F. Walker | 2006-10-03 |
| 6891360 | Plated probe structure | Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Da-Yuan Shih, Ho-Ming Tong | 2005-05-10 |
| 6812141 | Recessed metal lines for protective enclosure in integrated circuits | Michael C. Gaidis, Joachim Nuetzel, Walter Glashauser, Gregory Costrini, Stephen L. Brown +2 more | 2004-11-02 |
| 6784088 | Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped | Daniel C. Edelstein, Sung Kwon Kang, Maurice McGlashan-Powell, George F. Walker | 2004-08-31 |
| 6620719 | Method of forming ohmic contacts using a self doping layer for thin-film transistors | Paul S. Andry, Evan G. Colgan, John C. Flake, Peter M. Fryer, William Graham | 2003-09-16 |
| 6551931 | Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped | Daniel C. Edelstein, Sung Kwon Kang, Maurice McGlashan-Powell, George F. Walker | 2003-04-22 |
| 6525551 | Probe structures for testing electrical interconnections to integrated circuit electronic devices | Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Da-Yuan Shih | 2003-02-25 |
| 6426012 | Wet chemical etch process for patterning MRAM magnetic layers | Alejandro G. Schrott | 2002-07-30 |
| 6358832 | Method of forming barrier layers for damascene interconnects | Daniel C. Edelstein, Timothy J. Dalton, John G. Gaudiello, Mahadevaiyer Krishnan, Sandra G. Malhotra +2 more | 2002-03-19 |
| 6153935 | Dual etch stop/diffusion barrier for damascene interconnects | Daniel C. Edelstein, Timothy J. Dalton, John G. Gaudiello, Mahadevaiyer Krishnan, Sandra G. Malhotra +2 more | 2000-11-28 |
| 6060176 | Corrosion protection for metallic features | Krystyna W. Semkow | 2000-05-09 |
| 5855993 | Electronic devices having metallurgies containing copper-semiconductor compounds | Michael John Brady, Curtis E. Farrell, Sung Kwon Kang, Jeffrey R. Marino, Donald Joseph Mikalsen +5 more | 1999-01-05 |
| 5846598 | Electroless plating of metallic features on nonmetallic or semiconductor layer without extraneous plating | Krystyna W. Semkow | 1998-12-08 |
| 5834405 | Superconducting multilayer ceramic substrate | Byung-Tae Ahn, Robert B. Beyers, Emanuel I. Cooper, Edward A. Giess, Judith Marie Roldan +1 more | 1998-11-10 |
| 5755859 | Cobalt-tin alloys and their applications for devices, chip interconnections and packaging | Vlasta Brusic, Jeffrey R. Marino, Carlos J. Sambucetti, Alejandro G. Schrott, Cyprian Emeka Uzoh | 1998-05-26 |
| 5633047 | Electronic devices having metallurgies containing copper-semiconductor compounds | Michael John Brady, Curtis E. Farrell, Sung Kwon Kang, Jeffrey R. Marino, Donald Joseph Mikalsen +5 more | 1997-05-27 |
| 5453642 | Multilayer interconnect systems | Suryanarayana Kaja, Alejandro G. Schrott | 1995-09-26 |
| 5382447 | Process for fabricating improved multilayer interconnect systems | Suryanarayana Kaja, Alejandro G. Schrott | 1995-01-17 |
| 5380560 | Palladium sulfate solution for the selective seeding of the metal interconnections on polyimide dielectrics for electroless metal deposition | Suryanarayana Kaja, Shyama Mukherjee, Milan Paunovic | 1995-01-10 |
| 5310580 | Electroless metal adhesion to organic dielectric material with phase separated morphology | Terrence R. O'Toole, Judith Marie Roldan, Lubomyr T. Romankiw, Carlos J. Sambucetti, Ravi F. Saraf | 1994-05-10 |
| 5260108 | Selective seeding of Pd by excimer laser radiation through the liquid | Bodil E. Braren, Alejandro G. Schrott | 1993-11-09 |
| 4962086 | High T.sub.c superconductor - gallate crystal structures | William J. Gallagher, Edward A. Giess, Aranava Gupta, Robert Benjamin Laibowitz, Robert L. Sandstrom | 1990-10-09 |