Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9059194 | High-K and metal filled trench-type EDRAM capacitor with electrode depth and dimension control | Anne C. Friedman, Herbert L. Ho, Byeong Y. Kim, Dan M. Mocuta, Garrett W. Oakley +1 more | 2015-06-16 |
| 8582078 | Test method for determining reticle transmission stability | Timothy A. Brunner, Michael B. Pike | 2013-11-12 |
| 8491984 | Structure resulting from chemical shrink process over BARC (bottom anti-reflective coating) | Todd C. Bailey, Allen H. Gabor | 2013-07-23 |
| 8168451 | Optical inspection methods | Mary Jane Brodsky, Sean D. Burns, Habib Hichri | 2012-05-01 |
| 8110496 | Method for performing chemical shrink process over BARC (bottom anti-reflective coating) | Todd C. Bailey, Allen H. Gabor | 2012-02-07 |
| 8084185 | Substrate planarization with imprint materials and processes | Sean D. Burns, Ryan L. Burns | 2011-12-27 |
| 8023102 | Test method for determining reticle transmission stability | Timothy A. Brunner, Michael B. Pike | 2011-09-20 |
| 7917309 | System and method for detection and prevention of influx of airborne contaminants | — | 2011-03-29 |
| 7824846 | Tapered edge bead removal process for immersion lithography | — | 2010-11-02 |
| 7816069 | Graded spin-on organic antireflective coating for photolithography | Sean D. Burns, Dario L. Goldfarb, Michael Lercel, David R. Medeiros, Dirk Pfeiffer +3 more | 2010-10-19 |
| 7799503 | Composite structures to prevent pattern collapse | Allen H. Gabor, Javier Perez | 2010-09-21 |
| 7786017 | Utilizing inverse reactive ion etching lag in double patterning contact formation | Bradley Morgenfeld, Scott D. Allen, Wai-Kin Li | 2010-08-31 |
| 7645621 | Optical inspection methods | Mary Jane Brodsky, Sean D. Burns, Habib Hichri | 2010-01-12 |
| 7632631 | Method of preventing pinhole defects through co-polymerization | Steven Scheer | 2009-12-15 |
| 7588879 | Graded spin-on organic antireflective coating for photolithography | Sean D. Burns, Dario L. Goldfarb, Michael Lercel, David R. Medeiros, Dirk Pfeiffer +3 more | 2009-09-15 |
| 7541065 | Method of forming film stack having under layer for preventing pinhole defects | Wai-Kin Li, Steven Scheer | 2009-06-02 |
| 7494919 | Method for post lithographic critical dimension shrinking using thermal reflow process | Scott D. Allen | 2009-02-24 |
| 7493186 | Method and algorithm for the control of critical dimensions in a thermal flow process | Michael M. Crouse, Allen H. Gabor | 2009-02-17 |
| 7473461 | Film stack having under layer for preventing pinhole defects | Wai-Kin Li, Steven Scheer | 2009-01-06 |
| 7454302 | Method of inspecting integrated circuits during fabrication | MaryJane Brodsky | 2008-11-18 |
| 7390616 | Method for post lithographic critical dimension shrinking using post overcoat planarization | — | 2008-06-24 |
| 7354779 | Topography compensated film application methods | Scott Bukofsky, Allen H. Gabor | 2008-04-08 |
| 7310585 | Method of inspecting integrated circuits during fabrication | MaryJane Brodsky | 2007-12-18 |
| 7288478 | Method for performing chemical shrink process over BARC (bottom anti-reflective coating) | Todd C. Bailey, Allen H. Gabor | 2007-10-30 |
| 7267863 | Film stack having under layer for preventing pinhole defects | Wai-Kin Li, Steven Scheer | 2007-09-11 |