GL

Gill Yong Lee

Applied Materials: 18 patents #731 of 7,310Top 10%
Infineon Technologies Ag: 15 patents #716 of 7,486Top 10%
IBM: 9 patents #11,918 of 70,183Top 20%
SA Siemens Aktiengesellschaft: 6 patents #2,149 of 22,248Top 10%
AS Altis Semiconductor, Snc: 2 patents #5 of 27Top 20%
QA Qimonda Ag: 2 patents #153 of 575Top 30%
MI Micromaterials: 1 patents #24 of 34Top 75%
AS Altis Semiconductor: 1 patents #7 of 35Top 20%
🗺 California: #9,798 of 386,348 inventorsTop 3%
Overall (All Time): #67,178 of 4,157,543Top 2%
44
Patents All Time

Issued Patents All Time

Showing 26–44 of 44 patents

Patent #TitleCo-InventorsDate
6858441 MRAM MTJ stack to conductive line alignment method Joachim Nuetzel, Xian Jay Ning, Kia-Seng Low, Rajiv Ranade, Ravikumar Ramachandran 2005-02-22
6849465 Method of patterning a magnetic memory cell bottom electrode before magnetic stack deposition Chanro Park 2005-02-01
6806096 Integration scheme for avoiding plasma damage in MRAM technology Woosik Kim 2004-10-19
6783999 Subtractive stud formation for MRAM manufacturing 2004-08-31
6740539 Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates Richard A. Conti, Prakash Dev, David M. Dobuzinsky, Daniel C. Edelstein, Kia-Seng Low +3 more 2004-05-25
6713802 Magnetic tunnel junction patterning using SiC or SiN 2004-03-30
6649531 Process for forming a damascene structure William J. Cote, Timothy J. Dalton, Prakash Dev, Daniel C. Edelstein, Scott D. Halle +1 more 2003-11-18
6607984 Removable inorganic anti-reflection coating process Scott D. Halle, Jochen Beintner 2003-08-19
6570256 Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates Richard A. Conti, Prakash Dev, David M. Dobuzinsky, Daniel C. Edelstein, Kia-Seng Low +3 more 2003-05-27
6531412 Method for low temperature chemical vapor deposition of low-k films using selected cyclosiloxane and ozone gases for semiconductor applications Richard A. Conti, Daniel C. Edelstein 2003-03-11
6300672 Silicon oxynitride cap for fluorinated silicate glass film in intermetal dielectric semiconductor fabrication 2001-10-09
6281084 Disposable spacers for improved array gapfill in high density DRAMs Hiroyuki Akatsu, Ramachandra Divakaruni 2001-08-28
6184091 Formation of controlled trench top isolation layers for vertical transistors Ulrike Gruening, Jochen Beintner, Dirk Tobben, Oswald Spindler, Zvonimir Gabric 2001-02-06
6177698 Formation of controlled trench top isolation layers for vertical transistors Ulrike Gruening, Jochen Beintner, Dirk Tobben, Oswald Spindler, Zvonimir Gabric 2001-01-23
6103456 Prevention of photoresist poisoning from dielectric antireflective coating in semiconductor fabrication Dirk Tobben 2000-08-15
6060132 High density plasma CVD process for making dielectric anti-reflective coatings 2000-05-09
6020091 Hard etch mask 2000-02-01
6008120 Silicon oxynitride cap for fluorinated silicate glass film in intermetal dielectric semiconductor fabrication 1999-12-28
5955380 Endpoint detection method and apparatus 1999-09-21