Issued Patents All Time
Showing 101–125 of 138 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6426297 | Differential pressure chemical-mechanical polishing in integrated circuit interconnects | Kashmir Sahota, Krishnashree Achuthan | 2002-07-30 |
| 6423433 | Method of forming Cu-Ca-O thin films on Cu surfaces in a chemical solution and semiconductor device thereby | Krishnashree Achuthan | 2002-07-23 |
| 6420189 | Superconducting damascene interconnected for integrated circuit | — | 2002-07-16 |
| 6403466 | Post-CMP-Cu deposition and CMP to eliminate surface voids | — | 2002-06-11 |
| 6387818 | Method of porous dielectric formation with anodic template | — | 2002-05-14 |
| 6368965 | Method for low stress plating of semiconductor vias and channels | — | 2002-04-09 |
| 6368954 | Method of copper interconnect formation using atomic layer copper deposition | Carl Galewski, Takeshi Nogami | 2002-04-09 |
| 6368961 | Graded compound seed layers for semiconductors | Takeshi Nogami | 2002-04-09 |
| 6358848 | Method of reducing electromigration in copper lines by forming an interim layer of calcium-doped copper seed layer in a chemical solution and semiconductor device thereby formed | — | 2002-03-19 |
| 6350687 | Method of fabricating improved copper metallization including forming and removing passivation layer before forming capping film | Steven C. Avanzino, Kai Yang, Todd P. Lukanc | 2002-02-26 |
| 6348732 | Amorphized barrier layer for integrated circuit interconnects | Minh Van Ngo, Minh Quoc Tran | 2002-02-19 |
| 6346470 | Method for reducing electromigration in semiconductor interconnect lines | Takeshi Nogami | 2002-02-12 |
| 6346472 | Manufacturing method for semiconductor metalization barrier | John A. Iacoponi | 2002-02-12 |
| 6344410 | Manufacturing method for semiconductor metalization barrier | Shekhar Pramanick, Dirk Brown | 2002-02-05 |
| 6340633 | Method for ramped current density plating of semiconductor vias and trenches | John A. Iacoponi | 2002-01-22 |
| 6319616 | Scaled interconnect anodization for high frequency applications | Robin Cheung | 2001-11-20 |
| 6320263 | Semiconductor metalization barrier and manufacturing method therefor | John A. Iacoponi | 2001-11-20 |
| 6297146 | Low resistivity semiconductor barrier layer manufacturing method | — | 2001-10-02 |
| 6297157 | Time ramped method for plating of high aspect ratio semiconductor vias and channels | Matthew S. Buynoski | 2001-10-02 |
| 6291082 | Method of electroless ag layer formation for cu interconnects | — | 2001-09-18 |
| 6291348 | Method of forming Cu-Ca-O thin films on Cu surfaces in a chemical solution and semiconductor device thereby formed | Krishnashree Achuthan | 2001-09-18 |
| 6281587 | Multi-layered coaxial interconnect structure | Takeshi Nogami, Shekhar Pramanick | 2001-08-28 |
| 6259160 | Apparatus and method of encapsulated copper (Cu) Interconnect formation | Robin Cheung | 2001-07-10 |
| 6245670 | Method for filling a dual damascene opening having high aspect ratio to minimize electromigration failure | Robin Cheung | 2001-06-12 |
| 6242349 | Method of forming copper/copper alloy interconnection with reduced electromigration | Takeshi Nogami, Young-Chang Joo | 2001-06-05 |