| 10526708 |
Methods for forming thin protective and optical layers on substrates |
Stephen E. Savas, Hood Chatham, Sai Mantripragada, Allan B. Wiesnoski, Sooyun Joh |
2020-01-07 |
|
| 10294562 |
Exhaust manifold in a CVD reactor |
Stephen E. Savas, Merim MUKINOVIC |
2019-05-21 |
|
| 10049859 |
Plasma generating units for processing a substrate |
Stephen E. Savas, Allan B. Wiesnoski, Sai Mantripragada, Sooyun Joh |
2018-08-14 |
|
| 9831466 |
Method for depositing a multi-layer moisture barrier on electronic devices and electronic devices protected by a multi-layer moisture barrier |
Stephen E. Savas, Allan B. Wiesnoski |
2017-11-28 |
|
| 9443702 |
Methods for plasma processing |
Stephen E. Savas, Allan B. Wiesnoski, Sai Mantripragada, Sooyun Joh |
2016-09-13 |
$422,000 |
| 9359674 |
Apparatus and method for dielectric deposition |
Stephen E. Savas, Sai Mantripragada, Sooyun Joh, Allan B. Wiesnoski |
2016-06-07 |
|
| 9299956 |
Method for deposition of high-performance coatings and encapsulated electronic devices |
Stephen E. Savas, Allan B. Wiesnoski, Hood Chatham |
2016-03-29 |
|
| 9096932 |
Methods for plasma processing |
Stephen E. Savas, Allan B. Wiesnoski, Sai Mantripragada, Sooyun Joh |
2015-08-04 |
|
| 9096933 |
Methods for plasma processing |
Stephen E. Savas, Allan B. Wiesnoski, Sai Mantripragada, Sooyun Joh |
2015-08-04 |
|
| 8765232 |
Apparatus and method for dielectric deposition |
Stephen E. Savas, Sai Mantripragada, Sooyun Joh, Allan B. Wiesnoski |
2014-07-01 |
|
| 8697197 |
Methods for plasma processing |
Stephen E. Savas, Allan B. Wiesnoski, Sai Mantripragada, Sooyun Joh |
2014-04-15 |
|
| 6897119 |
Apparatus and method to achieve continuous interface and ultrathin film during atomic layer deposition |
Ofer Sneh, Thomas E. Seidel |
2005-05-24 |
|
| 6818067 |
Processing chamber for atomic layer deposition processes |
Kenneth Brian Doering |
2004-11-16 |
$1,184,000 |
| 6638859 |
Apparatus and method to achieve continuous interface and ultrathin film during atomic layer deposition |
Ofer Sneh, Thomas E. Seidel |
2003-10-28 |
$1,559,000 |
| 6635570 |
PECVD and CVD processes for WNx deposition |
Claude A. Sands, Hector Velasco, Lawrence D. Matthysse, Thomas E. Seidel |
2003-10-21 |
|
| 6540838 |
Apparatus and concept for minimizing parasitic chemical vapor deposition during atomic layer deposition |
Ofer Sneh |
2003-04-01 |
$1,110,000 |
| 6538327 |
Method of copper interconnect formation using atomic layer copper deposition and a device thereby formed |
Sergey Lopatin, Takeshi Nogami |
2003-03-25 |
$2,887,000 |
| 6503330 |
Apparatus and method to achieve continuous interface and ultrathin film during atomic layer deposition |
Ofer Sneh, Thomas E. Seidel |
2003-01-07 |
$1,712,000 |
| 6479902 |
Semiconductor catalytic layer and atomic layer deposition thereof |
Sergey Lopatin |
2002-11-12 |
$1,765,000 |
| 6451119 |
Apparatus and concept for minimizing parasitic chemical vapor deposition during atomic layer deposition |
Ofer Sneh |
2002-09-17 |
$433,000 |
| 6387185 |
Processing chamber for atomic layer deposition processes |
Kenneth Brian Doering, Prasad N. Gadgil, Thomas E. Seidel |
2002-05-14 |
$1,968,000 |
| 6368954 |
Method of copper interconnect formation using atomic layer copper deposition |
Sergey Lopatin, Takeshi Nogami |
2002-04-09 |
|
| 6305314 |
Apparatus and concept for minimizing parasitic chemical vapor deposition during atomic layer deposition |
Ofer Sneh |
2001-10-23 |
$1,291,000 |
| 6174377 |
Processing chamber for atomic layer deposition processes |
Kenneth Brian Doering, Prasad N. Gadgil, Thomas E. Seidel |
2001-01-16 |
$1,468,000 |
| 5855675 |
Multipurpose processing chamber for chemical vapor deposition processes |
Kenneth Brian Doering |
1999-01-05 |
$627,000 |
