Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Apparatus and concept for minimizing parasitic chemical vapor deposition during atomic layer deposition

Apparatus and concept for minimizing parasitic chemical vapor deposition during atomic layer deposition

US Patent 6305314 · Granted Oct 23, 2001

Estimated economic value: $1,291,000 ⓘ

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Face sealed fittings2021
Methods for forming thin protective and optical layers on substrates2020
Fluid-actuated flow control valves2019
Exhaust manifold in a CVD reactor2019
Plasma generating units for processing a substrate2018
Fluid-actuated flow control valves2018
Method for depositing a multi-layer moisture barrier on electronic devices and e2017
Methods for plasma processing2016
Apparatus and method for dielectric deposition2016
Method for deposition of high-performance coatings and encapsulated electronic d2016
Apparatus and methods for safely providing hazardous reactants2015
Methods for plasma processing2015