Issued Patents All Time
Showing 126–138 of 138 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6228759 | Method of forming an alloy precipitate to surround interconnect to minimize electromigration | Pin-Chin Connie Wang, Christy Mei-Chu Woo | 2001-05-08 |
| 6174799 | Graded compound seed layers for semiconductors | Takeshi Nogami | 2001-01-16 |
| 6144099 | Semiconductor metalization barrier | Shekhar Pramanick, Dirk Brown | 2000-11-07 |
| 6144096 | Low resistivity semiconductor barrier layers and manufacturing method therefor | — | 2000-11-07 |
| 6127282 | Method for removing copper residue from surfaces of a semiconductor wafer | — | 2000-10-03 |
| 6103086 | Method of forming reliable copper interconnects with improved hole filling | Christy Mei-Chu Woo, Axel Preusse | 2000-08-15 |
| 6103624 | Method of improving Cu damascene interconnect reliability by laser anneal before barrier polish | Takeshi Nogami, Dirk Brown | 2000-08-15 |
| 6096648 | Copper/low dielectric interconnect formation with reduced electromigration | Takeshi Nogami, Robin Cheung, Christy Mei-Chu Woo, Guarionex Morales | 2000-08-01 |
| 6083842 | Fabrication of a via plug having high aspect ratio with a diffusion barrier layer effectively surrounding the via plug | Robin Cheung | 2000-07-04 |
| 6060383 | Method for making multilayered coaxial interconnect structure | Takeshi Nogami, Shekhar Pramanick | 2000-05-09 |
| 6033982 | Scaled interconnect anodization for high frequency applications | Robin Cheung | 2000-03-07 |
| 6015747 | Method of metal/polysilicon gate formation in a field effect transistor | Takeshi Nogami, Shekhar Pramanik | 2000-01-18 |
| 5757104 | Method of operating an ultransonic piezoelectric transducer and circuit arrangement for performing the method | Igor Getman | 1998-05-26 |