Issued Patents All Time
Showing 26–41 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6441435 | SOI device with wrap-around contact to underside of body, and method of making | — | 2002-08-27 |
| 6403492 | Method of manufacturing semiconductor devices with trench isolation | Matthew S. Buynoski | 2002-06-11 |
| 6399480 | Methods and arrangements for insulating local interconnects for improved alignment tolerance and size reduction | William G. En, David K. Foote, Fei Wang, Minh Van Ngo | 2002-06-04 |
| 6166428 | Formation of a barrier layer for tungsten damascene interconnects by nitrogen implantation of amorphous silicon or polysilicon | Sunil Mehta, William G. En, Raymond T. Lee | 2000-12-26 |
| 6153933 | Elimination of residual materials in a multiple-layer interconnect structure | Steven C. Avanzino, Subramanian Venkatkrishnan, Minh Van Ngo, Christy Mei-Chu Woo de la Girond'arc, Diana M. Schonauer | 2000-11-28 |
| 6127261 | Method of fabricating an integrated circuit including a tri-layer pre-metal interlayer dielectric compatible with advanced CMOS technologies | Minh Van Ngo | 2000-10-03 |
| 6121663 | Local interconnects for improved alignment tolerance and size reduction | William G. En, David K. Foote, Fei Wang, Minh Van Ngo | 2000-09-19 |
| 6114235 | Multipurpose cap layer dielectric | David K. Foote, Minh Van Ngo, Christopher F. Lyons, Fei Wang, Raymond T. Lee +2 more | 2000-09-05 |
| 6096662 | NH.sub.3 /N.sub.2 plasma treatment to enhance the adhesion of silicon nitride to thermal oxide | Minh Van Ngo | 2000-08-01 |
| 6060393 | Deposition control of stop layer and dielectric layer for use in the formation of local interconnects | Minh Van Ngo, David K. Foote | 2000-05-09 |
| 6060404 | In-situ deposition of stop layer and dielectric layer during formation of local interconnects | Minh Van Ngo, Sey-Ping Sun, Terri Jo Kitson, John Caffall | 2000-05-09 |
| 6022799 | Methods for making a semiconductor device with improved hot carrier lifetime | David K. Foote, Minh Van Ngo | 2000-02-08 |
| 5895269 | Methods for preventing deleterious punch-through during local interconnect formation | Fei Wang, Minh Van Ngo, David K. Foote, William G. En | 1999-04-20 |
| 5614446 | Holding apparatus, a metal deposition system, and a wafer processing method which preserve topographical marks on a semiconductor wafer | Seshadri Ramaswami | 1997-03-25 |
| 5597458 | Method for producing alloy films using cold sputter deposition process | John Sanchez, Paul R. Besser | 1997-01-28 |
| 5456756 | Holding apparatus, a metal deposition system, and a wafer processing method which preserve topographical marks on a semiconductor wafer | Seshadri Ramaswami | 1995-10-10 |