Issued Patents All Time
Showing 51–75 of 140 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446085 | GOA circuit for solving problem of voltage level maintenance at the node Q | Baixiang Han | 2019-10-15 |
| 10141264 | Method and structure for wafer level packaging with large contact area | — | 2018-11-27 |
| 10043736 | Hybrid packaged lead frame based multi-chip semiconductor device with multiple interconnecting structures | Hamza Yilmaz, Jun Lu, Peter H. Wilson, Yan Huo, Zhiqiang Niu +1 more | 2018-08-07 |
| 9966328 | Semiconductor power device having single in-line lead module and method of making the same | Zhiqiang Niu | 2018-05-08 |
| 9960119 | Method and structure for wafer level packaging with large contact area | — | 2018-05-01 |
| 9929076 | Semiconductor package of a flipped MOSFET chip and a multi-based die paddle with top surface groove-divided multiple connecting areas for connection to the flipped MOSFET electrodes | Yueh-Se Ho, Hamza Yilmaz, Jun Lu | 2018-03-27 |
| 9854686 | Preparation method of a thin power device | Yuping Gong, Ming-Chen Lu, Ping Huang, Jun Lu, Hamza Yilmaz | 2017-12-26 |
| 9786583 | Power semiconductor package device having locking mechanism, and preparation method thereof | Hamza Yilmaz, Yueh-Se Ho, Jun Lu, De Mei Gong | 2017-10-10 |
| 9768146 | Battery protection package and process of making the same | Zhiqiang Niu, Man Sheng Hu, Jun Lu, Yueh-Se Ho, Hamza Yilmaz | 2017-09-19 |
| 9754864 | Semiconductor power device having single in-line lead module and method of making the same | Zhiqiang Niu | 2017-09-05 |
| 9679833 | Semiconductor package with small gate clip and assembly method | Hamza Yilmaz, Yueh-Se Ho, Jun Lu, Ming-Chen Lu, Hongtao Gao | 2017-06-13 |
| 9653383 | Semiconductor device with thick bottom metal and preparation method thereof | Hamza Yilmaz, Jun Lu, Ming-Chen Lu, Yan Huo, Aihua Lu | 2017-05-16 |
| 9564406 | Battery protection package and process of making the same | Zhiqiang Niu, Man Sheng Hu, Jun Lu, Yueh-Se Ho, Hamza Yilmaz | 2017-02-07 |
| 9520380 | Wafer process for molded chip scale package (MCSP) with thick backside metallization | Hamza Yilmaz, Yueh-Se Ho, Jun Lu, Zhiqiang Niu, Guo Feng Lian | 2016-12-13 |
| 9502268 | Method and structure for wafer level packaging with large contact area | — | 2016-11-22 |
| 9472491 | Semiconductor package with small gate clip and assembly method | Hamza Yilmaz, Yueh-Se Ho, Jun Lu, Ming-Chen Lu, Hongtao Gao | 2016-10-18 |
| 9431328 | Power device and preparation method thereof | Hamza Yilmaz, Jun Lu | 2016-08-30 |
| 9425181 | Method of hybrid packaging a lead frame based multi-chip semiconductor device with multiple interconnecting structures | Hamza Yilmaz, Jun Lu, Peter H. Wilson, Yan Huo, Zhiqiang Niu +1 more | 2016-08-23 |
| 9412684 | Top exposed semiconductor chip package | Yueh-Se Ho, Hamza Yilmaz, Anup Bhalla, Jun Lu, Kai Liu | 2016-08-09 |
| 9397029 | Power semiconductor package device having locking mechanism, and preparation method thereof | Hamza Yilmaz, Yueh-Se Ho, Jun Lu, De Mei Gong | 2016-07-19 |
| 9391005 | Method for packaging a power device with bottom source electrode | Yueh-Se Ho, Hamza Yilmaz, Jun Lu, Lei Shi, Liang Zhao +1 more | 2016-07-12 |
| 9337131 | Power semiconductor device and the preparation method | Yan Huo, Hamza Yilmaz, Jun Lu, Ming-Chen Lu, Zhi Qiang Niu +1 more | 2016-05-10 |
| 9305870 | Power semiconductor device and preparation method thereof | Hamza Yilmaz, Yueh-Se Ho, Jun Lu | 2016-04-05 |
| 9293397 | Power device and preparation method thereof | Hamza Yilmaz, Jun Lu | 2016-03-22 |
| 9281265 | Packaging structure of a semiconductor device | Yueh-Se Ho, Jun Lu, Lei Shi, Liang Zhao, Ping Huang | 2016-03-08 |