Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176292 | Microelectronic component having molded regions with through-mold vias | Sanka Ganesan, Xavier Francois Brun, Tarek A. Ibrahim, Jason M. Gamba, Manish Dubey +1 more | 2024-12-24 |
| 12087731 | No mold shelf package design and process flow for advanced package architectures | Wei Li, Edvin Cetegen, Nicholas S. Haehn, Nicholas Neal, Mitul Modi | 2024-09-10 |
| 12051647 | Pitch translation architecture for semiconductor package including embedded interconnect bridge | Andrew Collins, Bharat P. Penmecha, Rajasekaran Swaminathan | 2024-07-30 |
| 11984377 | IC die and heat spreaders with solderable thermal interface structures for assemblies including solder array thermal interconnects | Debendra Mallik, Je-Young Chang, Elah Bozorg-Grayeli, Ahmad Al Mohammad | 2024-05-14 |
| 11935808 | IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects | Debendra Mallik, Je-Young Chang, Elah Bozorg-Grayeli, Ahmad Al Mohammad | 2024-03-19 |
| 11923267 | IC die with solderable thermal interface structures for assemblies including solder array thermal interconnects | Debendra Mallik, Je-Young Chang, Elah Bozorg-Grayeli, Ahmad Al Mohammad | 2024-03-05 |
| 11901299 | Interconnect architecture with silicon interposer and EMIB | MD Altaf Hossain, Ankireddy Nalamalpu, Dheeraj Subbareddy, Robert Sankman, Ravindranath V. Mahajan +7 more | 2024-02-13 |
| 11901333 | No mold shelf package design and process flow for advanced package architectures | Wei Li, Edvin Cetegen, Nicholas S. Haehn, Nicholas Neal, Mitul Modi | 2024-02-13 |