Issued Patents 2024
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183596 | Low cost package warpage solution | Omkar G. Karhade, Debendra Mallik, Bassam M. Ziadeh, Yoshihiro Tomita | 2024-12-31 |
| 12181710 | Photonic integrated circuit packaging architecture | Omkar G. Karhade, Xiaoqian Li, Tarek A. Ibrahim, Ravindranath V. Mahajan | 2024-12-31 |
| 12176268 | Open cavity bridge co-planar placement architectures and processes | Omkar G. Karhade, Digvijay A. Raorane, Sairam Agraharam, Mitul Modi, Manish Dubey +1 more | 2024-12-24 |
| 12174436 | Package expanded beam connector for on-package optics | Wesley B. Morgan, Srikant Nekkanty, Todd Coons, Gregorio R. Murtagian, Xiaoqian Li +1 more | 2024-12-24 |
| 12148742 | Active bridge enabled co-packaged photonic transceiver | Thomas Liljeberg, Andrew C. Alduino, Ravindranath V. Mahajan, Ling Liao, Kenneth M. Brown +2 more | 2024-11-19 |
| 12113023 | Microelectronic structures including bridges | Omkar G. Karhade | 2024-10-08 |
| 12061371 | Patch on interposer architecture for low cost optical co-packaging | Xiaoqian Li, Omkar G. Karhade, Ravindranath V. Mahajan | 2024-08-13 |
| 12044888 | Silicon groove architectures and manufacturing processes for passive alignment in a photonics die | Omkar G. Karhade, Xiaoqian Li, Sujit Sharan | 2024-07-23 |
| 12027448 | Open cavity bridge power delivery architectures and processes | Omkar G. Karhade, Mitul Modi, Sairam Agraharam, Digvijay A. Raorane | 2024-07-02 |
| 11923307 | Microelectronic structures including bridges | Bai Nie, Gang Duan, Omkar G. Karhade, Yikang Deng, Wei-Lun Kane Jen +6 more | 2024-03-05 |
| 11887962 | Microelectronic structures including bridges | Omkar G. Karhade, Mohit Bhatia, Sairam Agraharam, Edvin Cetegen, Anurag Tripathi +6 more | 2024-01-30 |