Issued Patents 2023
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11832391 | Terminal connection routing and method the same | Aniket PATIL, Joan Rey Villarba BUOT | 2023-11-28 |
| 11823983 | Package with a substrate comprising pad-on-pad interconnects | Kun Fang, Jaehyun Yeon, Suhyung Hwang | 2023-11-21 |
| 11817365 | Thermal mitigation die using back side etch | Aniket PATIL, Jonghae Kim | 2023-11-14 |
| 11804645 | Multi-sided antenna module employing antennas on multiple sides of a package substrate for enhanced antenna coverage, and related fabrication methods | Joan Rey Villarba BUOT, Aniket PATIL | 2023-10-31 |
| 11791276 | Package comprising passive component between substrates for improved power distribution network (PDN) performance | Aniket PATIL, Joan Rey Villarba BUOT | 2023-10-17 |
| 11791320 | Integrated circuit (IC) packages employing a package substrate with a double side embedded trace substrate (ETS), and related fabrication methods | Joan Rey Villarba BUOT, Michelle Yejin Kim, Kuiwon Kang, Aniket PATIL | 2023-10-17 |
| 11784151 | Redistribution layer connection | Aniket PATIL, Marcus HSU | 2023-10-10 |
| 11776888 | Package with a substrate comprising protruding pad interconnects | Kuiwon Kang, Chin-Kwan Kim, Milind Shah | 2023-10-03 |
| 11749579 | Thermal structures adapted to electronic device heights in integrated circuit (IC) packages | Aniket PATIL, Bohan Yan | 2023-09-05 |
| 11749611 | Package with a substrate comprising periphery interconnects | Aniket PATIL | 2023-09-05 |
| 11715688 | Variable dielectric constant materials in same layer of a package | Aniket PATIL | 2023-08-01 |
| 11682607 | Package having a substrate comprising surface interconnects aligned with a surface of the substrate | Marcus HSU, Aniket PATIL | 2023-06-20 |
| 11658391 | Antenna module | Aniket PATIL, Jeahyeong Han, Mohammad Ali Tassoudji | 2023-05-23 |
| 11605595 | Packages with local high-density routing region embedded within an insulating layer | Aniket PATIL, Kuiwon Kang | 2023-03-14 |
| 11594491 | Multi-die interconnect | Li-Sheng Weng | 2023-02-28 |
| 11581262 | Package comprising a die and die side redistribution layers (RDL) | Aniket PATIL, Brigham NAVAJA, Yuzhe ZHANG | 2023-02-14 |
| 11581251 | Package comprising inter-substrate gradient interconnect structure | Aniket PATIL, Zhijie Wang, Joan Rey Villarba BUOT | 2023-02-14 |
| 11562962 | Package comprising a substrate and interconnect device configured for diagonal routing | Joan Rey Villarba BUOT, Aniket PATIL, Zhijie Wang | 2023-01-24 |
| 11552015 | Substrate comprising a high-density interconnect portion embedded in a core layer | Aniket PATIL, Kuiwon Kang | 2023-01-10 |
| 11551939 | Substrate comprising interconnects embedded in a solder resist layer | Kun Fang, Jaehyun Yeon, Suhyung Hwang | 2023-01-10 |
| 11545435 | Double sided embedded trace substrate | Kuiwon Kang, Zhijie Wang | 2023-01-03 |
| 11545439 | Package comprising an integrated device coupled to a substrate through a cavity | Aniket PATIL, Kuiwon Kang | 2023-01-03 |
| 11545425 | Substrate comprising interconnects embedded in a solder resist layer | Kun Fang, Jaehyun Yeon, Suhyung Hwang | 2023-01-03 |